Global and China Semiconductor Industry Report, 2008-2009
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According to China Semiconductor Industry Association, the integrated circuit industry scale was totaled at CNY 124.682 billion in 2008, a reduction of 0.4% of last year, which was the first time that a negative growth occurred in the recent 20 years. Driven by the constant consumption upgrading and 2008 Beijing Olympic Games, the industry maintained a growth of 10.4% in the first half of 2008, 12.5% and 8.3% respectively in the first quarter and second quarter. However, the growth rate sharply declined to 1.1% in the third quarter, and a negative growth of -20% in the fourth quarter, which was the biggest quarterly drop in the recent 20 years.

Considering the policy, China's semiconductor industry is currently in the dilemma, giving preferential policies will lead the issue of trade protectionism by the countries rely on semiconductor products export such as the U.S.A; if not, the Chinese companies will be more difficult to survive facing oversea competitors. 

China is the largest IC market in the world, with a market scale at US $85 billion in 2008, but the market share of domestic suppliers was less than 7%. Although China is the global factory of electronics products, the orders and shipments are both controlled outside.

Considering the IC design, China has few of IC design houses like Solomon, Actions, Spreadtrum and Vimicro. The Solomon, derived from the LCD division of Motorola, relies on Motorola, lack of product innovations. Backed by the Realtek, the Actions is the world’s largest sound card manufacturer and has an outstanding performance in the digital audio field. Spreadtrum recorded a reduction of 50% in the fourth quarter of 2008, far higher than Mediatek. Protected by the huge domestic demand for PC camera, Vimicro stays steady; however, caused by its high labor cost, the company recorded successively operational loss in the last four quarters.

IC design sector suffered the most with the transfer of international financial crisis to the real economy, especially those newly established companies due to the break of their capital chain, venture investors also draw back, and the A-turn investment dropped 82% during 2000-2007. According to GSA, there were 74 companies shut down since Oct 2008, and most of which were small companies.

Nevertheless, the wafer OEM maintains a high expansion in china. Since its establishment in the year of 2000, SMIC has built productions in Shanghai, Beijing, Tianjin, Chengdu, Wuhan and Guangzhou through M&A and trusteeship. In addition, guided by Shanghai Government, the Huahong Group acquired Grace Semiconductor at the beginning of 2009, along with an extra investment of US $2.2 billion for a 12-inch wafer plant. However, the fact is that SMIC has been recording a loss since its establishment.

The cost structure of semiconductor manufacturing is roughly as following: machine depreciation 50%, materials 20%, water & power 5% and labor 10%. For Chinese companies, only 15% of the cost can be controlled, while the part has been played to the full extent. Moreover, the unilateral understanding to scale has fettered their imaginations of strategy, which makes the semiconductor industry in the situation of unmerited scale.

In addition, the semiconductor industry is always protected by governments, dare not or unwilling to face with the market-oriented risk. The Chartered is a typical example.
There are two typical development routes regarding the wafer OEM, one is represented by the TSMC: focus on the technology and high-profit business; the other is represented by the UMC: huge investment on IC design houses for the purpose of production capacity enhancement, for example the investment to MTK, Novatek and SIS are all proved successful. Novatek is the second largest IC design house in Taiwan, as well as the global second largest TFT-LCD drive IC manufacturer. MTK is the top mobile phone vendor and the 7th largest IC design house in the world, as well as the largest IC design house in Taiwan. 

It is not enough to just invest a huge capital and the semiconductor industry also requires more input in the basic science and technology especially in China.

1 Status Quo and Trend of Global Semiconductor Industry 
1.1 Semiconductor Industry Output Value Forecast in 2009 & Retrospect 
1.2 Status Quo of Global Semiconductor Companies 
1.3 Status Quo and Trend of Global Wafer Manufacturing 
1.4 Semiconductor Device Market 
1.5 Semiconductor Materials Market 
1.6 Status Quo and Trend of Global IC Design Houses 

2 Status Quo and Trend of China’s Semiconductor Industry 
2.1 Policies 
2.2 Market Overview
2.3 Wafer OEM 
2.4 Taiwan Semiconductor Industry
2.5 Taiwan IC Design 
2.6 IC Design Industry in Mainland China 
2.6.1 Company Scale
2.6.2 Wafer OEM
2.6.3 Products 
2.6.4 Product Applications 
2.6.5 Design Technology 

3 Wafer OEM Industry 
3.1 Horizontal Comparison 
3.2 SMIC 
3.3 TSMC 
3.4 UMC 
3.5 Chartered Semiconductor 
3.6 Dongbu Electronics 
3.7 Vanguard International Semiconductor Corporation (VIS)
3.8 X-FAB
3.9 ASMC 
3.10 China Res MICRO 
3.11 Huahong NEC 
3.12 Grace Semiconductor 
3.13 Hejian 

4 IC Packaging and Testing Industry 
4.1 Horizontal Comparison 
4.2 ASE 
4.3 Amkor 
4.4 SPIL 
4.5 StatsChipPAC 
4.6 Jiangsu Changjiang Electronics Technology 

5 Key IC Design Hosues
5.1 Solomon 
5.2 Vimicro
5.3 Actions
5.4 Spreadtrum
Forecast of Semiconductor Industry Output Value in 2009
Monthly Output of Notebooks, 2008 & 2009e
Global IC Shipment, 1982-2013e
Capital Expenditure of Global IC Industry, 1996-2011e
0.045-0.18 um IC Cost Structure
Expenditure of Global Wafer Devices, 2007Q1-2009Q4e 
Global Wafer Shipment and IC Shipment, 2003Q1-2008Q4
Production Capacity of Global 8-inch/12-inch Wafer Fabs, 2000Q1-2010Q2e
Product Distribution Layout of Global Wafer Fabs, 2000, 2008 & 2010e
Production Capacity Distribution of Global 12-inch Wafer Fabs by Region, 2000-2010e
Production Capacity Distribution of Global Wafer Fabs by Region, 2000-2010e
Regional Distribution of Global Semiconductor Device Market, 2007 & 2008 
Global Semiconductor Materials Market Scale, 2004-2008
Global Photoresist Market Scale, 2007Q1-2008Q3
Global Ancillary Chemical Market Scale, 2007Q1-2008Q3
A-round Investment Funds for IC Design Houses, 2000-2008
Analysis on IC Invalidation, 2006-2008
China's Semiconductor Market Scale, 1999-2008
IC Market Demand in China, 2000-2010
Global GDP and Output Value Growth of China Semiconductor Industry, 2000-2009e
Output Value Growth of China Semiconductor, 2006Q1-2008Q4
Output Value Structure of China Semiconductor Industry, 2003-2008
Revenues of Seven Key Wafer Foundries in China, 2004-2008 
Production Capacity of Wafer Fabs in China according to inch, 2001-2010e
Semiconductor Materials Market Layout in China, 2003-2010e
Employee Distribution of IC Design Houses in China
Design Engineer Distribution of IC Design Houses in China
The Concerns of IC Design House Regarding Wafer OEM in China
Market Promotions of IC Design Houses in China
Business Distribution of IC Design Houses in China
Analog/Mixed Signal Product Distribution of IC Design Houses in China, 2008 & 2009e 
Digital Signal Products Distribution of IC Design Houses in Mainland China, 2008 & 2009e
Consumer Electronics Product Proportion of Chinese IC Design Houses by Application
Computer Products Proportion of Chinese IC Design Houses by Application
Network Products Proportion of Chinese IC Design Houses by Application
Other Products Proportion of Chinese IC Design Houses by Application
Gate Distribution of ASIC Products of Chinese IC Design Houses
Gate Distribution of CPLD and FPGA Products of Chinese IC Design Companies
Design Problems of Chinese IC Design Houses
Average Price of Individual Wafer and Average Revenue Created by Individual Employee of Global Four Largest Wafer Foundries in 2008 
Operating Profit Margins of Global Four Largest Wafer Foundries, 2003-2008 
Revenues and Operating Profit Margins of Four Large Wafer Foundries, 2008
Production Capacity and Capacity Utilization Ratio of Global Four Largest Wafer Foundries, 2008Q4
Client Structure of Global Four Largest Wafer Foundries, 2008Q4
Regional Revenue of Global Four Largest Wafer Foundries, 2008Q4
Product Proportion of Global Four Largest Wafer Foundries by Application, 2008Q4
Revenue and Operating Profit of SMIC, 2003-2008
Output of SMIC by Production Line, 2007Q1-2008Q4 
Production Capacity and Capacity Utilization Ratio of SMIC, 2007Q1-2008Q4
Client Structure of SMIC, 2006Q1-2008Q4
Regional Revenue of SMIC, 2006Q1-2008Q4
Product Proportion of SMIC by Application, 2006Q1-2008Q4
Revenue of SMIC by Product, 2006Q1-2008Q4
Organization Structure of TSMC
Revenue and Operating Profit of TSMC, 2003-2008
Revenue and Operation Profit Margin of TSMC, 2007Q1-2008Q4
Capacity of Wafer Foundries of TSMC, 2008Q1-2008Q4
Products of TSMC by Technology, 2007Q1-2008Q4
Product Application Structure of TSMC, 2007Q1-2008Q4
Client Structure of TSMC, 2007Q1-2008Q4
Regional Revenues of TSMC, 2007Q1-2008Q4
High-Voltage Technology Roadmap of TSMC
Revenue and Operating Profit Margin of UMC, 2000-2008 
Production Capacity of UMC, 2000-2008
Wafer Shipment of UMC, 2007Q4-2008Q4
Regional Revenue of UMC, 2005-2008
Client Structure of UMC, 2005-2008
Product Proportion of UMC by Application, 2005-2008
Product Structure of UMC by Technology, 2005-2008
Product Structure of UMC by Technology, 2007Q4-2008Q4
Employee Educational Background of UMC, 2004-2006 
Revenue and Net Profit Margin of Chartered Semiconductor, 1998-2008
Wafer Shipment, Production Capacity and Capacity Utilization Ratio of Chartered Semiconductor, 2007Q1-2008Q4
Production Capacity of Wafer Fabs of Chartered Semiconductor, 2007Q1-2008Q4
Product Proportion of Chartered Semiconductor by Application, 2007Q1-2008Q4
Regional Revenue of Chartered Semiconductor, 2007Q1-2008Q4
Technology Structure of Chartered Semiconductor, 2007Q1-2008Q4
Technology Roadmap of Chartered Semiconductor
Production Capacity of Dongbu Electronics, 2005-2009e
Technology Roadmap of DongbuAnam
Revenue and Operating Profit Margin of VIS, 2005-2008
Revenue and Capacity Utilization Ratio of VIS, 2007Q1-2008Q4
Revenue and Gross Profit Margin of VIS, 2007Q1-2008Q4
Product Structure of VIS by Technology, 2007Q1-2008Q4
Product Proportion of VIS by Application, 2007Q1-2008Q4
High-Voltage Technology Roadmap of VIS
NVM Technology Roadmap of VIS
Revenue and Pre-tax Profit of X-FAB, 2004-2008
Technology Roadmap of X-FAB
Shareholding Structure of ASMC before Listed
Shareholding Structure of ASMC after Listed
Revenue and Gross Profit Margins of ASMC, 2003-2008
Regional Revenue of ASMC, 2007Q2-2008Q4
Client Structure of ASMC, 2007Q2-2008Q4
Revenue of ASMC by Production Line, 2007Q2-2008Q4
Capacity Utilization Ratio of ASMC by Production Line, 2007Q2-2008Q4
Organization Structure of China Resources Microelectronics
Revenue of China Resources Microelectronics by Product, 2007 & 2008 
Revenue and Profit of China Resource Microelectronics, 2002-2008
Technique Roadmap of Shanghai Huahong NEC
Client Structure of Global Four Biggest Packaging Manufacturers, 2008
Application Proportion of Global Four Biggest Packaging Manufacturers, 2008
Revenue and Gross Profit Margin of ASE, 2001-2010e
Organization Structure of ASE
Revenue, Gross Profit Margin, Operating Profit and Operating Profit Margin of ASE, 2007Q1-2008Q4
Revenue and Gross Profit Margin of ASE IC Packaging Business Dept, 2007Q1-2008Q4
Product Structure of Packaging Dept of ASE, 2007Q1-2008Q4
Revenue Structure of IC Packaging Dept of ASE, 2007Q1-2008Q4
Revenue and Gross Profit Margin of Materials Dept of ASE, 2007Q1-2008Q4
Core Packaging Technologies of ASE
Revenue and Operating Profit Margin of Amkor Technology, 2003-2009e
Revenue and Gross Profit Margin of Amkor Technology, 2006Q3-2008Q4
Administrative Expenditure and R&D Expenditure of Amkor Technology, 2006Q3-2008Q4
Top Ten Clients of Amkor Technology, 2007Q2-2008Q4
Product Proportion of Amkor Technology by Application, 2007Q2-2008Q4
Organization Structure of SPIL
Revenue and Operating Profit Margin of SPIL, 2003-2009e
Product Structure of SPIL by Technology, 2008Q3 & 2008Q4
Product Proportion of APIL by Application, 2008Q3 & 2008Q4
Client Structure of SPIL, 2008Q3 & 2008Q4
Regional Revenue of SPIL, 2008Q3 & 2008Q4
Revenue and Operating Profit Margin of StatsChipPAC, 2005-2008
Revenue of StatsChipPAC by Product, 2007Q2-2008Q4
Products Proportion of StatsChipPAC by Application, 2007Q2-2008Q4
Regional Revenue of StatsChipPAC, 2007Q2-2008Q4
Capacity Utilization Ratio of StatsChipPAC, 2007Q2-2008Q4
Organization Structure of New Trend Group
Revenue and Gross Profit Margin of Jiangsu Changjiang Electronics Technology Co., Ltd., 2003-2010e
Revenue of Jiangsu Changjiang Electronics Technology Co., Ltd., 2007Q1-2008Q3
Revenue of Jiangsu Changjiang Electronics Technology Co., Ltd by Product, 2006-2010
Revenue of Jiangsu Changjiang Electronics Technology Co., Ltd by Technology, 2008Q1-Q3
Revenue and Gross Profit Margin of Solomon Systech, 2003-2008
Aerage Sales Price of Solomon Systech, 2003-2008
Shipment Structure of Solomon Systech, 2003-2008
Revenue and Gross Profit Margin of Vimicro, 2001-2008
Vimicro's Revenue by Product, 2005-2008
Revenue and Gross Profit Margin of Actions Semiconductor, 2003-2008
Revenue and Gross Profit Margin of Actions Semiconductor, 2007Q1-2008Q4
Product Roadmap of Actions Semiconductor
Average Sales Price of Spreadtrum, 2006Q1-2008Q1
Cost Structure of Spreadtrum, 2006Q1-2008Q1
Spreadtrum's Revenue, 2003-2008
Revenue and Gross Profit Margin of Spreadtrum, 2006Q1-2008Q4
EDGE Baseband Product Planning of Spreadtrum
3G Baseband Roadmap of Spreadtrum
SC6600V CMMB Mobile Phone TV Solutions of Spreadtrum
Development Roadmap of Mobile Phone TV Multimedia Solutions of Spreadtrum
Typical Applications of SC8800H
Typical Applications of SC8800D
Ranking of Global Top 20 Semiconductor Vendors, 2007 & 2008 
Ranking of Global Top 20 Semiconductor Vendors, 2008Q4
Liabilities of Global Top 20 Semiconductor Vendors, 2008Q4
Ranking of Global Top 15 IC Device Manufacturers by Revenue, 2006-2008 
Ranking of Global Top 10 IC Design Houses, 1994-2008Q2
Key Trans-invested Companies of UMC
Revenue of Global Key Wafer Foundries, 2005-2008 
Revenues and Operating Profit Margins of VIS, ASMC, X-Fab, CSMC and TOWER, 2006-2008
Key Wafer Foundries of SMIC
Wafer Fabs of TSMC
Features of TSMC 45-nano Technique
Features of TSMC 55-nano Technique
Features of TSMC 65-nano Technique
Mixed Signal/RF Technique of TSMC
Features of TSMC SiGe BiCMOS Technique
Production Capacity of Wafer Fabs of UMC, 2006Q1-2009Q1
Key Trans-invested Companies of UMC
RF CMOS/Mixed Signal Technology of Chartered Semiconductor
Logic Product Technology of Dongbu HiTEK
CMOS Image Sensor Technology of Dongbu HiTEK
High-voltage Technologies of Dongbu HiTEK
RF Technologies of Dongbu HiTEK
Low-power Products Technologies of Dongbu HiTEK
IP Inventory of Dongbu HiTEK
Wafer Shipment of VIS, 2008Q1-2008Q4
Revenues of Global Top 10 IC Packaging Companies, 2007-2008
Revenue, Operating Profit Margin and Capacity Utilization Ratio of Global Four Largest Packaging Manufacturers, 2008
Packaged IC Shipment of Amkor Technology, 2007Q2-2008Q4
Production Capacities of SPIL in 2006Q1, 2007Q2 & Q3, 2008Q3-Q4
Mobile Phone RF Chip Shipment of Spreadtrum, 2005-2008

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