Semiconductor Equipment Industry Report, 2009
  • Nov/2009
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The drastic fluctuations in semiconductor industry are astonishing. NAND flash memory stood out conspicuously during the period of 2005-2007, the shipment boosted up, and manufacturers successively invested in NAND field. The emerging DDR2 was once promoted greatly by Microsoft Vista. In wafer OEM, a fierce competition on advanced manufacturing process is under way, and the manufacturers all have continuously pushed forward 90nm and 65nm, so the shipment of semiconductor equipments increased considerably. The coming into being of new packaging forms such as FC, CSP, and WLP also conduced to the development of semiconductor equipment industry. Therefore, the period from 2005 to 2007 was the boom for semiconductor industry, and many manufacturers doubled their revenue. However, while they were in high spirits, the semiconductor industry had started to plunge.

The decline in 2008 was just the beginning, the year of 2009 witnessed more dramatically drop, and the revenue of nearly all the manufacturers was less than 50% of the level in 2007, or even 20%. Especially lithography industry in the front-end area of semiconductor equipment, the top three manufacturers, ASML, NIKON and CANON, respectively fell by 44%, 73% and 84%. Almost all the manufacturers have suffered the loss.

It was a bit better for the manufacturers in the back-end field of semiconductor equipment industry, particularly testing sector, it witnessed a small drop.

Global Top 20 Semiconductor Manufacturers by Revenue, 2007-2009
Unit: US$ in Millions

The situation improved in the second half of 2009, particularly in memory field, the largest market in semiconductor equipment industry. In IDM sector, Intel is still the largest semiconductor equipment client. Since semiconductor equipment industry is lack of unparalleled applications, revolutionary products and technologies, so it is not likely that the rapid growth during 2005-2007 will come back.

1 Semiconductor Industry 
1.1 Current Situation 
1.2 Semiconductor Equipment 
1.3 EUV vs. ArF 
1.4 15-inch Wafer 

2 Semiconductor Equipment Industry and Market 
2.1 Semiconductor Equipment Market 
2.2 Wafer Semiconductor Equipment Market 
2.3 Global Semiconductor Market by Region 

3 Semiconductor Equipment Industry 
3.1 Overview 
3.2 Regional Distribution 
3.2.1 Taiwan 
3.2.2 Mainland, China 
3.3 Automatic Testing 
3.4 Etching 

4 Semiconductor Equipment Downstream Market  
4.1 Wafer OEM 
4.1.1 Status Quo 
4.1.2 Capital Expenditure 
4.1.3 GlobalFoundries
4.1.4 TSMC
4.1.5 UMC 
4.1.6 SMIC
4.2 Memory Industry 
4.2.1 NAND 
4.2.2 Toshiba 
4.2.4 DRAM 
4.2.5 HYNIX and Samsung Process Progress 
4.2.6 DRAM Manufacturers’ Expenses, 2010  
4.3 IDM
4.4 Packaging & Testing Industry 

5 Semiconductor Equipment Manufacturers 
5.1 Applied Materials 
5.2 ASML
5.3 KLA-Tencor
5.4 Hitachi High-Tech 
5.5 TEL
5.7 DNS
5.10 LamResearch
5.11 Zeiss SMT
5.12 Teradyne
5.13 Novellus
5.14 Verigy
5.15 Varian
5.16 Hitachi Kokusai Electric 
5.17 ASM International 
5.18 Canon
Ratio of Global Semiconductor Order to Shipment, Jan, 1997-Jul, 2009 
Ratio of Order to Shipment of North American Semiconductor Manufacturers, Jan, 2007-Sep, 2009
IC Design Industry Chain 
Wafer Manufacturing Flow 
Global Semiconductor Equipment Market Size, 2006-2012E 
Global Semiconductor Equipment Capital Expenditure, 1987-2010E 
Global Semiconductor Materials Revenue, 1987-2010E 
Construction Investment of Global Wafer Fabs, 2008Q1-2010Q4E
Equipment Investment of Global Wafer Fabs, 2008Q1-2010Q4E
Investments of Global Wafer Fabs, 2008Q1-2010Q4E 
Global Equivalent 8-inch Wafer Output Capacity by Downstream Product Type, 1998-2010E 
Output Capacity Distribution of Global Wafer Fabs, 2008Q1-2010Q4E 
Global Semiconductor Market by Region, 2008
Global Semiconductor Market by Region, 2009 vs. 2010 (forecast)
Global Semiconductor Equipment Market by Technology, 2007-2010E 
Global Semiconductor Market Distribution by Downstream Application, 2009-2010E 
Global Wafer Fabrication Materials Market Size and Regional Distribution, 2008-2009 
Global Packaging Plant Materials Market Size and Regional Distribution, 2008-2009 
Output Value of Semiconductor Equipment Industry, 2009 
Output Value of Semiconductor Industry by Region, 2009 
Taiwan Semiconductor Equipment Market by Technology, 2008 
Taiwan Semiconductor Equipment Imported Value by Country, 2008 
Global Semiconductor ATE Market by Downstream Application, 2009 
Global Semiconductor ATE Market by Region, 2009
Market Shares of Main Global Automatic Testing Manufacturers, 2007 
Market Shares of Global Automatic Testing Manufacturers, 2008
Market Shares of Main Semiconductor Etching Equipment Manufacturers, 2005-2008
Wafer Output Capacity Utilization Rate, 2004Q1-2010Q4E 
Wafer OEM Industry Revenue, 2008Q1-2010Q4E 
Global Main Wafer OEM Output Capacity, 2007-2012E 
TSMC Revenue and Operating Profit Margin, 2003-2009 
TSMC Revenue and Operating Profit Margin, 2007-2009Q3 
TSMC Revenue by Process, 2007Q1-2009Q3 
UMC Revenue and Operating Profit Margin, 2000-2009 
UMC Revenue by Process, 2007Q4-2009Q3
UMC Output Capacity Change, 2006Q1-2009Q4 
SMIC Revenue and Operating Profit Margin, 2003-2009
SMIC Revenue by Process, 2007Q1-2009Q3
NAND and DRAM Manufacturers’ Capital Expenditure, 2005-2013E 
16 & 32 GB 4GX8 MLC NAND Price Trend, Nov, 2008-Nov, 2009 
Toshiba NAND Distribution by Process, 2009Q2-2010Q3 
Time of Global DRAM Manufacturers to Enter DDR3, 2008Q4-2011Q1 
HYNIX DRAM Distribution by Process, 2009Q2-2010Q3 
HYNIX NAND Distribution by Process, 2009Q2-2010Q3 
Samsung RAM Distribution by Process, 2009Q2-2010Q3 
Samsung NAND Distribution by Process, 2009Q2-2010Q3 
Applied Materials Revenue and Gross Profit Margin, 2004-2009FY 
Applied Materials Revenue by Division, 2006-2009FY 
Applied Materials Sales and Operating Profit, Q1-Q4, 2009FY
Applied Materials Revenue by Division, Q42009FY 
Applied Materials Orders by Region, Q42009FY 
Applied Materials Order Sum by Region, 2006FY-Q3 2009FY 
Applied Materials Sales by Region, 2006FY-Q3 2009FY 
Applied Materials Order Sum by Division, 2006FY-Q3 2009FY 
ASML Revenue and Operating Profit Margin, 2004-2009
ASML Quarterly Revenue, 2003-Q32009
ASML Gross Profit Margin and Operation Profit Margin, Q12008-Q32009 
ASML Shipment by Technology, Q12008-Q32009 
ASML Revenue by Region, Q12008-Q32009 
ASML Revenue by Clients, Q12008-Q32009 
Backlog Client Distribution, 2008-Q32009 
Backlog Regional Distribution, 2008-Q32009 
ASML DRAM Equipment Output Capacity Utilization Rate, Jan, 2007-Aug, 2009 
ASML NAND Equipment Output Capacity Utilization Rate, Jan, 2007-Aug, 2009
KLA-Tencor Revenue and Operating Profit Margin, 2005-2009FY 
KLA-Tencor Revenue by Region, 2007-2009FY 
Hitachi Hi-tech Revenue by Division, 2009-2010FY 
Hitachi Hi-tech Operating Profit by Division, 2009-2010FY 
Hitachi Hi-tech Semiconductor Equipment Revenue by Product, 2009-2010FY
Hitachi Hi-tech Semiconductor Equipment Revenue by Region, 2009-2010FY
TEL Revenue and Operating Profit, 2001FY-2010FY 
TEL Revenue and Operating Profit Margin, Q22007FY-Q22010FY 
TEL Quarterly Order Sum by Division, Q32000FY-Q32009FY 
TEL Revenue by Division, 2009FY-H12010FY
TEL Semiconductor Equipment Revenue by Region, 2009FY-2010FY 
TEL FPD/PVE Equipment Revenue by Region, 2009FY-2010FY 
TEL Order Balance, Q32007-Q32009
TEL Order Volume by Region, Q32007-Q32009 
TEL Semiconductor Equipment Department's Orders by Product Type, Q32005-Q32009
Nikon Revenue and Operating Profit, 2004FY-2010FY 
Nikon Precision Revenue and Operating Profit, 2006FY-2010FY 
Nikon Precision’s Exposure Machine Semiconductor Sales Volume by Technology, 2008FY-2010FY 
Nikon Precision’s Exposure Machine Semiconductor Sales Volume by Region, 2008FY-2010FY
Nikon Precision’s Flat Panel Display Exposure Machine Sales Volume by Generation, 2008FY-2010FY 
DNS Revenue and Operating Profit, 2004FY-2009FY 
DNS Revenue by Division and Operating Profit Margin, Q32008FY -Q22010FY
DNS Order Sum by Division, Q32008FY-Q22010FY
DNS Semiconductor Equipment Revenue by Downstream Application, Q42007FY-Q12010FY 
DNS Flat Panel Display Revenue by Generation, Q42008FY-Q22010FY 
AXITRON Employee Number, 2003-2008 
AXITRON Revenue by Technology, Q1-Q3, 2009 
AXITRON Revenue by Downstream Application, Q1-Q3, 2009 
AXITRON Revenue by Region, 2006-Q32009 
AXITRON Revenue by Downstream Application, 2006-Q32009 
ADVENTES Revenue and Operating Profit Margin, 2003FY-2010FY 
ADVENTES Revenue and Order, Q32006-Q22009 
ADVENTES Order by Division, Q12008FY-Q22009FY 
ADVENTES Order by Region, Q12008FY-Q22009FY 
ADVANTEST Revenue by Division, Q12008FY-Q22009FY 
ADVANTEST Revenue by Region, Q12008FY-Q22009FY 
ADVANTEST Expense Distribution, Q12008FY-Q22009FY 
LamResearch Revenue and Operating Profit, 2005FY-2009FY
LamResearch Revenue by Region, 2007FY-2009FY 
Zeiss SMT Revenue and Client Distribution, 2004FY-2008FY
Teradyne Revenue and Operating Profit, 2004-2009
Teradyne Order by Region, 2006-2008 
Teradyne Revenue by Region, 2006-2008 
Verigy Revenue and Operating Profit, 2004-2009 
Verigy Revenue by Region, 2006-2008 
Verigy Revenue by Downstream Application, Q12005-Q32009 
Varian Revenue and Operating Profit, 2004FY-2009FY 
Varian Revenue by Business, 2006FY-2009FY
Varian Revenue by Region, 2006FY-2008FY
Varian Revenue by Downstream Application, 2006FY-2008FY 
Hitachi Kokusai Electric Revenue and Operating Profit, 2005FY-2009FY
Hitachi Kokusai Electric Revenue by Division, 2007FY-2009FY
ASM Front-end and Back-end Revenue, 2006-2009 
ASM Revenue and Operating Profit, 2004-2009
ASM Front-End Equipment Revenue by Region, 2006-2008 
ASM Back-End Equipment Revenue by Country, 2006-2008
Canon Revenue and Net Profit, 1999FY-2009FY 
Canon Revenue by Product, 1999FY-2008FY
Global Top 20 Semiconductor Manufacturers by Revenue, 2007-2009 
Rank of Global Wafer OEMs, Q12009 
Expenses of Global Wafer OEMs, Q12007-Q42009 
TSMC Output Capacity Change, Q12008-Q42009 
Profile of UMC's Trans-invested Companies
Profile of SMIC Wafer Fabs
Operating Revenue of NAND Manufacturers, Q2-Q3, 2009 
Rank of Global DRAM Memory Manufacturers, Q32009 
Taiwan Memory Manufacturers’ Revenue, Q12008-Aug, 2009 
Wafer Output of Taiwan Memory Manufacturers, Q12008-Q4 2009
Expense Forecast of Global Main DRAM Manufacturers, 2010 
Global Top 20 Semiconductor Companies, Q1-Q3, 2009 
Global Top 20 Semiconductor Companies by Capital Expenditure, 2008-2009 
Revenue Forecast of Global Top 19 IC Packaging Plants, 2009 
ASML's Current Products 
KLA-Tencor’s Products 
ASM International’s ALD and CVD Products 
ASM International’s Packaging Equipment 
ASM R&D Staff and Division Location by Field 
ASM Production Bases

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