Automotive semiconductor and automotive electronics industry present booming development with fast growing technology and huge market opportunities. Aiming at promoting industry development and exchange of know-how, cooperation of companies and products, as well as project financing, we host this forum.

With the main theme of new technology, product and solution in automotive semiconductor and automotive electronics industry, this forum focuses on such topic as ADAS, automotive safety, intelligence and automated driving, sensor, auto ICs, automotive electronics.

In addition, this forum also leaves room for project docking, media exclusive interview, presentation and exhibition, etc. There will be around 200 commercial and technical leaders from OEM, operator, parts, semiconductor, technology solution, software and service field participated, who discuss the prospect and development directions of automotive electronics and semiconductor. We are glad to help companies get deep understanding on industry dynamics, also expand contact network and business opportunities.

We will invite the technical leaders from such famous companies as BAIC, FAW, SAIC, Changan auto, Dongfeng Auto, Greatwall, JAC, GEELY, BMW, Benz, Ford, GM, Honda, Toyota, BYD, Harman, Bosch, Delphi, Infineon, Fairchild, NXP, Broadcom, CSR, Intel, Atmel, Fujitsu, Vector, Mathworks, Electrobit, ARM, Renesas, ST Microelectronics, Freescale, Sensata, Denso, ON Semiconductor, Spreadtrum, Mediatek, Hangsheng, Coagent, Huayang, YF Visteon, Desay SV, who will share their experiences and development strategies.

• Marketing Director of NXP Automotive Electronics Segment
• Director of Delphi Packard Electric System Co., Ltd
• Chang’an Automotive Engineering Research Institute
• General Manager of Foton Zhike Information Technology Service Co
• Deputy Manager of Neusoft IA Segment
• Director of Technology Center Innovation and Product Management, Desay SV
• Technology Center Chief of Benteler
• Director of Product Application, Greater China Automotive Electronics Business, NXP
• Senior Manager of ROHM Design Center
• Automotive Project Manager of Advanced Semiconductor
• Chief Engineer of Automotive Electronics Segment of FAW R&D Center
• General Manager of Ningbo Xinlu Communication Technology Co., Ltd.
• Deputy Manager of Weike Electronic Machine (Shanghai) Co., Ltd.
• Deputy Secretary General of Shenzhen Automotive Electronics Industry Association
• Vice President of Bosch Automotive Products (Suzhou)
• Marketing Director of EMAPGO
• Executive Vice-President of Automotive Engineering Research Institute, GAC Group
• Director of Beijing Research Institute of Panasonic R&D Center China
• President of Blaupunkt
• Deputy Manager of Goke Microelectronics
• General Manager Assistant of Shanghai International Automobile City
• Product Manager of Spansion Inc Automotive Electronics
• General Manager of Suzhou INVO Automotive Electronics
• Senior Manager of Electrical Engineering Department, SVW
• General Manager of Shenzhen SEG Scientific Navigations Co., Ltd.
• Head Engineer of Safety Technology Development Department, Geely Automotive Research Institute
• Director of Intelligent Technology & Communication Research Lab of Dongfeng Commercial Vehicle
• Director of West Operation Center of Hongjing (Wuhu) Electronics
• General Manager of Automotive Electronics Business of Techman Electronics (Changshu)
• Director of Telecom Technology Strategy and Standard of Intel China
• Deputy Manager of PROTRULY
• Deputy Manager of Autochip, subsidiary of MTK
• Datang NXP
• O-film
• ZTE Welink
• Dahua Technology
• Huawei Technology
• Coagent
• Huayang
• Hangsheng
• Denso China
• Longcheer 3G Shanghai
• Panasonic
• BAIC New Energy
• Greatwall
• JMC
• Leadcore Technology
• YF Visteon
• STMicroelectronics

• Development status and future trend of automotive electronics and auto chip
• Intelligentization, networking and integration of auto electronics system
• ADAS chip, algorithm and solutions
• Auto sensors: radar, infrared, CMOS image, MEMS, etc
• Auto processor and controller: MCU/DSP/GPU, VCU/ECU, etc
• Auto power semiconductor: power management IC, BMS, IGBT, Diodes
• Auto lamp control//LED/display chip and solutions;
• Application of flexible display and lighting in automotive;
• GPU image processing, storage chip and solution;
• Automotive microcontroller integration development trend and design & processing challenge
• Vehicle security alarm system and safety identification technology
• Auto active safety innovative solution;
• In-vehicle electronic device: In-vehicle computer, navigation and recorder, rearview mirror/HUD, etc
• In-vehicle infotainment system; In-vehicle communication and in-vehicle network

There are also exhibitions of automotive semiconductor components, automotive sensor (radar, infrared, CMOS image, MEMS), cockpit electronics, automotive LED/onboard display, onboard communication terminal, and in-vehicle infotainment terminal, etc, besides theme speech.

• Government bodies
• Associations & organizations
• Automakers
• Semiconductor companies
• Core parts manufacturers
• Core technology suppliers
• Telecom operators
• Communication equipment providers
• Investors
• Research agencies
• Telematics companies
• Automotive electronics companies
• Automotive media and websites
• Software developers
• Entrepreneur team