ASP for DRAM packaging and testing set to fall in 4Q10 - ResearchInChina

Date:2010-09-30liaoyan  Text Size:

ASPs for standard DRAM packaging and testing are set to fall by 2-3%, or even more, sequentially in the fourth quarter of 2010, according to industry sources. The estimated price drop is relatively larger when compared to the mere 1-3% drop during the previous three quarters.

Despite the price-cut pressure, backend suppliers will still benefit from capacity ramp-ups by DRAM producers using more advanced processes, the sources indicated. Some memory backend houses, such as Powertech Technology and Walton Advanced Engineering, still stand a chance of generating slight revenue growth sequentially in the fourth quarter, the sources said.

PTI and Walton are expected to see their sales stay at high levels in September, according to the sources. Both companies' revenues for the third quarter will also be able to meet their guidance, the sources believe.

PTI mainly provides DRAM backend services for Elpida Memory and Rexchip Electronics, while Walton's major DRAM customers include Winbond Electronics, Powerchip Technology and Nanya Technology.

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