Winbond launches serial flash MCP memory solutions - ResearchInChina

Date:2010-11-01liaoyan  Text Size:

Winbond Electronics has delivered its serial flash multi-chip packaging (MCP) memory products to MediaTek and Spreadtrum Communications for verification, and the company will also promote the MCP solutions directly to leading handset players, according to industry sources.

Winbond said that its SDRAM parts have ventured into the automobile segment and that it will begin promote its NOR flash products to the same sector.

Sales of NOR flash products stayed flat sequentially in the third quarter of 2010, but were up 179% from a year earlier. Additionally, Winbond plans to launch a series of new NOR flash products, including 4-64Mb 1.8V serial flash, 32/64/128Mb parallel flash devices, the company noted.

Winbond's serial flash MCP memory solutions are paired with its in-house developed pseudo SRAM chips which are more competitive than those parallel flash products, according to the company.

2005-2011 www.researchinchina.com All Rights Reserved 京ICP备05069564号-1