Solar wafer maker Danen Technology has moved up the construction of phase two of its second plant and will hold the ground breaking ceremony on January 11, 2011. Phase two will have a capacity of 200MWp with completion scheduled for the third quarter, bringing the company's total capacity to 520MWp. The second phase of expansion will require an investment of NT$2.7 billion (US$92.48 million).

Danen's first plant has a capacity of 120MWp and phase one of the second plant will reach 200MWp in the first half of 2011. The company had originally planned to begin phase two in the second half of the year, but has moved up the schedule due to strong orders.

Fellow solar wafer maker Eversol also broke ground for a new plant in December 2010 with operation expected to commence in October 2011. The company will invest NT$9 billion for a capacity of 750MWp ultimately and bring overall capacity to more than 1GWp.

Eversol's current capacity is at 350MWp and should increase to 500MWp by year's end.