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China Semiconductor Industry Report, 2005

Published: Oct/2005

Hard Copy  USD $ 2,200
Pages: 150 Electronic(PDF)  USD $ 2,300
Report Code: CA029 Enterprisewide  USD $ 3,450
 

According to China Semiconductor Industry Association, there were about 50 wafer manufactories, 102 IC packaging and IC assembly factories, and 457 IC design houses by the end of 2004. The output value of China's semiconductor industry was 36.4 billion Yuan (about $4.4 billion) in 2004, among which, packaging accounted for over 50%, wafer manufacturing took 30%, while IC design below 20%. The domestic market scale of China's semiconductor industry was over $30 billion in 2004, $22.5 billion of which belonged to 20 major manufacturers.

Packaging industry is the core part of China's semiconductor industry. And the packaging enterprises in China mainland all serve foreign enterprises only. Most of the top 20 semiconductor suppliers established packaging bases in mainland China – either wholly owned, or co-established with overseas partners. The clients of the largest domestic packaging manufacturers are from overseas. Strictly speaking, there are very few native packaging enterprises in China.

Top 10 packaging plants of China mainland in 2004 are listed below, among which only Jiangsu Changjiang Electronics Technology Co., Ltd was invested by had mainland's major investors.

Manufacturer

Operating income of 2004million yuan

Major capital source

Business

Major clients

Location

Freescale (former Tianjin plant of Motorola)

8120

US

Having IC packaging

Freescale

Tianjin

RF Micro Devices, Inc (RFMD)

2580

US

Having IC packaging

RFMD

Beijing

Renesas Stone Semiconductor Beijing, RSSB

1858

Japan, China

Having IC packaging

Renesas

Beijing

Intel

1600

US

Having IC packaging

Intel

Shanghai

Nantong Fujitsu

1449

Japan, China

Having IC packaging

Fujitsu

Nantong

STATS ChipPAC Ltd

780

Singapore

Professional IC packaging

SMIC, STMicroelectronics

Shanghai

STS Microelectronics

769

Italy, France, China

Having IC packaging

STMicroelectronics

Shenzhen

Jiangsu Changjiang Electronics Technology Co., Ltd

736

China

Professional IC packaging

SMIC,

Hangzhou Silan Microelectronics

Jiangyin

Global Advanced Packaging TechnologyGAPT

426

Taiwan

Professional IC packaging

Huahong NEC

Shanghai

Infineon Technologies

391

Germany

Having IC packaging

Infineon

Wuxi

 

China's wafer plants can be divided into four groups: first, plants whose major investors are overseas Chinese, relying on the government's support, whose technical people are mainly from TSMC, UMC, and Vanguard International Semiconductor Corporation (VIS). SMIC is a typical example of this kind. Second, joint ventures. Huahong and NEC co-invested to establish Huahong NEC, and Philips invested in Advanced Semiconductor Manufacturing Corporation Limited. The investments of these companies are mainly bank loans, and these companies mainly serve their foreign investors. Third, Taiwan-based or Taiwan invested companies. For instance, UMC for Hejian Technology is UMC. Once the policy allows it, Nanya, ProMOS Technologies, PSC will all invest in China mainland. Four, domestic investment. The investment capitals is mainly bank loans. The utilization rate of these companies production capacity is low, or cannot be put into production due to the lack of technology.

China's wafer market has saturated, whose increase speed will slow down a lot after 2005. However, inspired by the preferential policies, there are still wafer plants being established (19 are under construction).

 



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