Shenzhen Danbond Technology Co.,Ltd. is principally engaged in the research, development, production and distribution of flexible printed circuit boards (FPCs), chip on flexible (COF) printed circuit packaging laminates, as well as COF products. The Company's products are mainly applied in electronic terminals. The Company's FPC products include FPC for mobile phones, FPC for laptops, FPC for liquid crystal displays (LCDs) and plasma displays, as well as FPC for digital cameras, hard disks, optical disk drives, mobile storages and other personal computer (PC) accessories. Its COF printed circuit packaging laminates and COF products include COF products for LCDs, COF products for light emitting diodes (LEDs), COF products for laser read-write heads, as well as high frequency and high density impedance COF products.