Intelligent Cockpit Domain Control Unit (DCU) and Head Unit Dismantling Report, 2023 (1)
  • Feb.2023
  • Hard Copy
  • USD $2,200
  • Pages:61
  • Single User License
    (PDF Unprintable)       
  • USD $2,000
  • Code: SDY015
  • Enterprise-wide License
    (PDF Printable & Editable)       
  • USD $3,000
  • Hard Copy + Single User License
  • USD $2,400
      

Dismantling of Head Unit and Cockpit Domain Control Unit (DCU) of NIO, Toyota and Great Wall Motor

The report highlights the dismantling of Toyota’s MT2712-based head unit, Fisker’s Intel A2960-based head unit, Great Wall Motor’s Qualcomm 8155-based head unit and NIO ET7 cockpit DCU, and estimates and analyzes Great Wall Motor’s head unit and NIO’s DCU.

This article takes NIO ET7 cockpit DCU we dismantle as an example.

"In terms of hardware, NIO ET7 packs a second-generation digital cockpit that is equipped with a 12.8-inch AMOLED center console screen, a 10.2-inch HDR digital cluster, a 6.6-inch HDR multi-function control screen in the rear row, and an enhanced head-up display (HUD) system. It runs the Banyan IVI System based on Qualcomm Snapdragon 8155 chip. The head unit carries the 16GB+256GB memory portfolio, supports multiple unlock methods like UWB digital key, and is equipped with some remote functions and AR-HUD system, as well as a built-in driving recorder.”

域控拆解 1_副本.png

Appearance and interfaces

NIO ET7 bears NIO’s second-generation cockpit DCU. Compared with the first-generation, the SoC chip of the second-generation cockpit DCU is changed from Nvidia Parker to Qualcomm SA8155P. The second-generation cockpit DCU will be applied to all NIO models.

域控拆解 2_副本.png

The interfaces on the lower side of the bottom view in the above picture, from left to right, are: center console display and rear display connector, cluster and HUD connector, 1 USB3.0 connector, 2 USB connectors, and 2 Ethernet connectors, and inside the white plastic sleeves are WiFi and Bluetooth antennas.

NIO ET7 cockpit DCU has a distinctive appearance. The heat sink on the backboard is recessed in the middle in a bid to be close to the SA8155P module that generates the most heat.

The interior of the housing of NIO ET7 cockpit DCU is relatively complicated. The inner layer of the housing is also embedded with a spongy material that absorbs impact. The holes on the right correspond to the two large capacitors on the PCB. The two capacitors are relatively high with ultra-large capacity up to 25 farads. They function as a battery. It is presumed that the two capacitors are added in the consideration of the fact that sometimes when a vehicle is parked for too long, the battery runs out of power but some wireless remote vehicle control functions still need to work.

域控拆解 3_副本.png

Unlike most vehicle PCBs with connectors on one side, NIO’s cockpit DCU PCB has connectors on both sides.

CPU and memory chip

域控拆解 4_副本.png

In the center of the DCU PCB lies the SoC module which accommodates one SA8155P chip, two PMM8155AU power management chips and two Micron memory chips.

Next to the capacitor side of the SoC module is a 256GB UFS 2.1 memory chip from Samsung. UFS 2.1 features working voltage of 1.8/3.3V, G3 2Lane interfaces, and temperature range of -40℃~105℃. The estimated price range of this chip is USD15-20.

域控拆解 5_副本.png

Ethernet switch

The relatively big chip next to the MCU and the capacitor is an 88EA6321 Ethernet switch provided by Marvell.

域控拆解 6_副本.png

The picture above shows the internal framework of Marvell 88E6321, a 7-port Ethernet switch for automotive EAVB. 88E6321 carries two IEEE 10/100/1000BASE-T/TX/T interfaces (corresponding to RJ45, namely, a conventional registered jack as often said), two RGMII/xMII interfaces or one GMII interface, two SGMII/SerDes interfaces, and one RGMII/xMII interface. The MII (medium-independent interface) is a standard interface connecting the MAC and the PHY. It is an IEEE-802.3 defined Ethernet industry standard.

10/100/1000BASE-T/TX/T refers to the transmission cable. Port 2, 5 and 6 can be configured as MAC or PHY mode, and all support RGMII/RMII/MII. Port 2 and 6 also support GMII. Port 3 and 4 support 10M/100M/1000M adaptive Ethernet interfaces. Port 0 and 1 support 100M/1000M optical ports (SFP). 88E6321 launched around 2014 is an old product that does not support the latest TSN. It is not an automotive Ethernet switch in the strict sense, and is currently sold at a markdown price of about USD10-15. (MII refers to Medium Independent Interface; RMII, Reduced MII; SMII, Serial MII; GMII, Giga MII)

Video I/O

域控拆解 7_副本.png

The picture above is the video input part of ET7 cockpit DCU. It uses a total of 4 serializer/deserializer chips (all from MAXIM, a company acquired by ADI), including two MAX96712 deserializer chips, one of which corresponds to the inputs of the four 3-megapixel surround-view cameras of NIO ET7.

域控拆解 8_副本.png

The picture above is the internal framework of MAX96712 which enables MIPI CSI-2 4Lane reception and delivers the maximum bandwidth of 6Gbps, that is, it can connect four 4-megapixel cameras and outputs two channels. It is currently the highest bandwidth deserializer chip priced at about USD15-20.

域控拆解 9_副本.png

The video output part of NIO’s head unit in the picture above uses three TI serializer chips and video format conversion. All the three serializer chips require signing a non-disclosure agreement (NDA). SA8155 can support a variety of up to 24-megapixel display configuration interfaces (e.g., at most three 4K60 displays) via three native displays. It supports two 4-lane DSI D-PHY at 2.5 Gbps per lane or two 3-trio C-PHY at 5.7 Gbps per lane, an integrated display port shared with USB 3.1 Gen 2 at 8.1 Gbps/lane. It allows for 4K60 display ports concurrency and USB 3.0 operation, and enables other display single interfaces (DDSI) by using DisplayPort multi-stream transport (MST) and dual displays.

Back of PCB

域控拆解 10_副本.png

There is a flying line on the front and back of the PCB. The flying line on the back is very obvious, about 4.5cm in length, which means that the PCB needs hand soldering in the end. This will affect efficiency and quality stability, and will also push up the overall cost of the cockpit DCU.

1 Dismantling of Toyota’s Low-to-mid-end Head Unit
1.1 Front Appearance of the Head Unit 
1.2 Back of the Display Module
1.3 Display Module Motherboard 
1.4 Internal Structure
1.5 Upper PCB of the Head Unit
1.5.1 Bluetooth and WiFi Module
1.5.2 LVDS Receiver and Memory Chip
1.5.3 Video I/O
1.6 Lower PCB of the Head Unit 
1.6.1 Audio DSP
1.6.2 MCU
1.7 Parameters of the Key Device: Chip

2 Dismantling of Fisker’s Head Unit 
2.1 Introduction to Fisker
2.2 Boom Diagram of the Head Unit
2.3 Appearance & Interfaces
2.4 Upper PCB of the Head Unit
2.4.1 Main Control Chip and Memory Chip
2.4.2 FPGA Chip and FPD-LINK Chip
2.5 Lower PCB and MCU of the Head Unit
2.5.1 Digital Audio Broadcasting Chip and AM/FM Radio Tuner Chip
2.6 Parameters of the Key Device: FPGA
2.7 Parameters of the Key Device: Digital Audio Broadcasting (DAB) Chip

3 Dismantling of Great Wall Coffee Intelligent Head Unit 
3.1 Dimensions
3.1.1 Top View
3.1.2 Side View
3.2 Interfaces of the Head Unit
3.3 Front of the Upper PCB of the Head Unit
3.4 Back of the Upper PCB of the Head Unit
3.5 Front of the Lower PCB of the Head Unit
3.6 Back of the Lower PCB of the Head Unit
3.7 Key Devices Suppliers and Cost Estimation - Summary
3.7.1 Parameters of the Key Device: Ethernet Switch
3.7.2 Parameters of the Key Device: Audio Processing Chip
3.7.3 Parameters of the Key Device: Serializer and Video Conversion
3.7.4 Parameters of the Key Device: MCU

4 Dismantling of NIO ET7 Cockpit DCU 
4.1 Appearance Structure of the DCU
4.2 Internal Structure of the DCU
4.3 Interfaces of the DCU
4.4 Front of the DCU PCB 
4.4.1 Chip Module
4.4.2 Memory Chip
4.4.3 MCU
4.4.4 Ethernet Switch
4.4.5 Ethernet Physical Layer Chip
4.4.6 Serializer/Deserializer Chip
4.4.7 Video Output
4.4.8 WiFi and Bluetooth Module
4.4.9 Radio Chip
4.4.10 Capacitor
4.5 Back of the DCU PCB 
4.6 Parameters and Cost Estimation of Key Devices
4.6.1 Parameters of the Key Device: MCU
4.6.2 Parameters of the Key Device: Ethernet Switch
4.6.3 Parameters of the Key Device: Deserializer Chip
4.6.4 Parameters of the Key Device: CMOS Real Time Clock (RTC) and Calendar
 

Automotive Microcontroller Unit (MCU) Industry Report, 2024

With policy support, the localization rate of automotive MCU will surge. Chinese electric vehicle companies are quickening their pace of purchasing domestic chips to reduce their dependence on impor...

Automotive Digital Key Industry Trends Research Report, 2024

Automotive Digital Key Industry Trends Research Report, 2024 released by ResearchInChina highlights the following: Forecast for automotive digital key market;Digital key standard specifications and co...

Automotive XR (VR/AR/MR) Industry Report, 2024

Automotive XR (Extended Reality) is an innovative technology that integrates VR (Virtual Reality), AR (Augmented Reality) and MR (Mixed Reality) technologies into vehicle systems. It can bring drivers...

OEMs’ Next-generation In-vehicle Infotainment (IVI) System Trends Report, 2024

OEMs’ Next-generation In-vehicle Infotainment (IVI) System Trends Report, 2024 released by ResearchInChina systematically analyzes the iteration process of IVI systems of mainstream automakers in Chin...

Global and China Automotive Lighting System Research Report, 2023-2024

Installations of intelligent headlights and interior lighting systems made steady growth. From 2019 to 2023, the installations of intelligent headlights and interior lighting systems grew steadily. I...

Automotive Display, Center Console and Cluster Industry Report, 2024

Automotive display has become a hotspot major automakers compete for to create personalized and differentiated vehicle models. To improve users' driving experience and meet their needs for human-compu...

Global and China Passenger Car T-Box Market Report, 2024

Global and China Passenger Car T-Box Market Report, 2024 combs and summarizes the overall global and Chinese passenger car T-Box markets and the status quo of independent, centralized, V2X, and 5G T-B...

AI Foundation Models’ Impacts on Vehicle Intelligent Design and Development Research Report, 2024

AI foundation models are booming. The launch of ChapGPT and SORA is shocking. Scientists and entrepreneurs at AI frontier point out that AI foundation models will rebuild all walks of life, especially...

Analysis on Geely's Layout in Electrification, Connectivity, Intelligence and Sharing

Geely, one of the leading automotive groups in China, makes comprehensive layout in electrification, connectivity, intelligence and sharing. Geely boasts more than ten brands. In 2023, it sold a tota...

48V Low-voltage Power Distribution Network (PDN) Architecture Industry Report, 2024

Automotive low-voltage PDN architecture evolves from 12V to 48V system. Since 1950, the automotive industry has introduced the 12V system to power lighting, entertainment, electronic control units an...

Automotive Ultrasonic Radar and OEMs’ Parking Route Research Report, 2024

1. Over 220 million ultrasonic radars will be installed in 2028. In recent years, the installations of ultrasonic radars in passenger cars in China surged, up to 121.955 million units in 2023, jumpin...

Automotive AI Foundation Model Technology and Application Trends Report, 2023-2024

Since 2023 ever more vehicle models have begun to be connected with foundation models, and an increasing number of Tier1s have launched automotive foundation model solutions. Especially Tesla’s big pr...

Qualcomm 8295 Based Cockpit Domain Controller Dismantling Analysis Report

ResearchInChina dismantled 8295-based cockpit domain controller of an electric sedan launched in December 2023, and produced the report SA8295P Series Based Cockpit Domain Controller Analysis and Dism...

Global and China Automotive Comfort System (Seating system, Air Conditioning System) Research Report, 2024

Automotive comfort systems include seating system, air conditioning system, soundproof system and chassis suspension to improve comfort of drivers and passengers. This report highlights seating system...

Automotive Memory Chip and Storage Industry Report, 2024

The global automotive memory chip market was worth USD4.76 billion in 2023, and it is expected to reach USD10.25 billion in 2028 boosted by high-level autonomous driving. The automotive storage market...

Automotive AUTOSAR Platform Research Report, 2024

AUTOSAR Platform research: the pace of spawning the domestic basic software + full-stack chip solutions quickens. In the trend towards software-defined vehicles, AUTOSAR is evolving towards a more o...

China Passenger Car Electronic Control Suspension Industry Research Report, 2024

Research on Electronic Control Suspension: The assembly volume of Air Suspension increased by 113% year-on-year in 2023, and the magic carpet suspension of independent brands achieved a breakthrough ...

Global and China Hybrid Electric Vehicle (HEV) Research Report, 2023-2024

1. In 2025, the share of plug-in/extended-range hybrid electric passenger cars by sales in China is expected to rise to 40%. In 2023, China sold 2.754 million plug-in/extended-range hybrid electric p...

2005- www.researchinchina.com All Rights Reserved 京ICP备05069564号-1 京公网安备1101054484号