In 2015, NXP acquired Freescale for USD11.8 billion, hereby becoming the largest automotive semiconductor vendor. Yet NXP's development progress has not always gone smoothly. In 2021, Infineon replaced NXP as the biggest automotive semiconductor vendor.
In 2022, NXP’s revenue jumped by 19.4% on the previous year to USD13.205 billion, 52% of which was from the Automotive; its net income hit USD2.833 billion, soaring by 48.6%. Despite a good growth, NXP was still positioned second in the industry.

NXP S32 Automotive Platform is designed for autonomous driving, involving the perception, decision and actuation. Among NXP's main ADAS chips, S32R is used for radars, S32A for L3~L5 CPUs, S32V for visual processing, S32G for automotive gateways, S32Z/S32E for real-time processing and power domain controller systems, and S32K for small domain controllers and small sub-nodes.

NXP once worked hard on S32V vision processor and BlueBox ADAS domain controller, but the result was not as expected. By contrast, it succeeded in S32R and S32G.
NXP has gambled on 4D imaging radar and network processor since 2022.
NXP has established a solid foothold in automotive radars for more than 20 years. By 2022, it had launched six generations of radar chips, and has transitioned to RFCMOS as early as the fourth generation. NXP has a leading position in the automotive radar market, offering radar technology to the top 20 automotive OEMs in the world.
In early 2022, NXP released the industry’s first dedicated 16nm imaging radar processor, the NXP S32R45, which is also the flagship of NXP’s 6th generation automotive radar chipset family. Additionally, the new NXP S32R41 was introduced to extend 4D imaging radar’s benefits to a much larger number of vehicles including high-end cars, vehicles used for mobility services, and mainstream passenger cars. Together these processors serve the L2+ through L5 autonomy sectors, enabling 4D imaging radar for 360-degree surround sensing.
Radar developers such as Hawkeye and Hasco have developed 4D imaging radars based on NXP S32R45.
Based on NXP S32R45, Hasco has developed 4-chip cascaded imaging radar, with a detection range of 350 meters, 1° horizontal resolution, 2° pitch resolution and ±75° FOV, covering more blind spots. Hasco has a high expectation of the prospect that 4D radar will completely replace conventional ordinary radars in the future. LRR30, Hasco’s 4D radar, can output 1,024 4D point clouds and track up to 64 objects. It is one of the first imaging radar sensors to be production-ready in the market. The LRR40 being developed by Hasco can output up to 3,072 4D point clouds and track 128 objects.

The layout in vehicle intelligence in recent year reveals that NXP focuses on deploying radar chips and network processors.

NXP's Thinking on Intelligent Transformation of the Automotive Industry
NXP believes that the automotive industry is building a new triangle value chain. OEMs are mainly responsible for architecture definition and system integration. To this end, they need basic technologies and chip platforms from semiconductor companies, as well as hardware and software integration and software actuation provided by Tier 1 suppliers. NXP aims to gradually step in the triangle value chain as a technical partner. That is to say, a technology company like NXP should have a team that serves Tier 1 suppliers, and another team targeting OEMs. Therefore, in recent years, NXP has been increasing the number of system engineers and software engineers to enhance its complete system-level solutions. In terms of products, NXP is transforming into a chip supplier, that is, it is integrating more software on the basis of chips. NXP’s software engineers have outnumbered hardware engineers. NXP continues system-level investments, in a bid to deeply understand how the automotive architecture develops and evolves.
Obviously, other automotive chip vendors such as Horizon Robotics are following suit, making the chip toolchain and grouped algorithms as perfect as possible to reduce the chip introduction workload for OEMs and Tier1 suppliers.
The automotive industry is heading towards software-defined vehicles, and it requires brand-new automotive software development methods to handle ECU integration, data-driven automotive services, secure cloud connection and service-oriented architectures. Automakers and Tier1 suppliers are confronted with new challenges in multi-tenancy (one MPU supports multiple virtual MCUs), network management, cloud services, functional safety and advanced safety technology. This makes it extremely difficult for automakers and Tier1 suppliers to introduce automotive intelligent chips.
NXP’s S32G Vehicle Integration Platform (GoldVIP) provides a reference vehicle integration platform that accelerates S32G hardware evaluation, software development and rapid prototyping efforts. NXP helps address these challenges with GoldVIP’s pre-integrated software, including from partners Airbiquity, Amazon Web Services, Argus Cyber Security and Elektrobit.
GoldVIP has integrated the following software:
Airbiquity OTAmatic client (for OTA updates)
AWS IoT Greengrass V2 edge runtime (for secure cloud services)
Elektrobit tresos AUTOSAR Classic Platform
Argus Cyber Security Intrusion Detection and Prevention System

Related Reports:
Ambarella’s Intelligent Driving Business Analysis Report, 2022-2023
NXP’s Intelligence Business Analysis Report, 2022-2023
Jingwei Hirain’s Automotive and Intelligent Driving Business Analysis Report, 2022-2023
Continental’s Intelligent Cockpit Business Analysis Report, 2022-2023
Bosch’s Intelligent Cockpit Business Analysis Report, 2022-2023
Baidu’s Intelligent Driving Business Analysis Report, 2022-2023
Aptiv’s Intelligent Driving Business Analysis Report, 2022-2023
ZF’s Intelligent Driving Business Analysis Report, 2022-2023
Continental’s Intelligent Driving Business Analysis Report, 2022-2023
Bosch’s Intelligent Driving Business Analysis Report, 2022-2023
Horizon Robotics’ Business and Products Analysis Report, 2022-2023
Desay SV’s Intelligent Driving Business Analysis Report, 2022-2023
Renesas Electronics’ Automotive Business Analysis Report, 2023
Infineon’s Intelligent Vehicle Business Analysis Report
Haomo.AI’s Intelligent Driving Business Analysis Report
SenseTime’s Intelligent Vehicle Business Analysis Report
OEMs and Tier1s’ Intelligent Cockpit Platform (Hardware and Software) Innovation Strategy Research Report, 2026
Intelligent Cockpit Platform Research: multi-dimensional cockpit system architecture reconstruction for multi-agent collaboration and proactive intelligent services
The intelligent cockpit software s...
Automotive AIOS Research Report, 2026
Automotive AIOS Research: Mass Production Solutions Are Implemented
Mass Production Solutions Are Implemented on A Small Scale.
In 2026, AIOS starts small-scale implementation, helping to improve v...
Automotive Telematics Service Provider (TSP) Research Report, 2026
TSP Research: Leading providers collectively turn to AI agents to provide all-scenario active services
Telematics Service Providers (TSPs) are the core hub of the telematics industry chain, connectin...
Automotive Smart Interior Research Report, 2026
Smart Interior Research: As Technologies like Interactive Starlight Headliner, Hidden Display and Surface Projection Are Launched, Automotive Interiors Become Ever More Intelligent
The Automotive Sma...
Research Report on AI Applications in Cockpits, 2026
AI Application in Cockpits: AI Services Become More Comprehensive, Convenient, and Refined.
In the first half of 2026, cockpit AI functions underwent initial upgrades across multiple dimensions, inc...
Software-Defined Vehicles in 2026: OEM Software Development and Supply Chain Deployment Strategy Research Report
Research on OEMs’ Software Strategies: R&D Focus, Development Strategies and Supplier Building Models of 30 OEMs
In this paper, we adopt a research framework covering 13 subsystems and 48 sub-di...
Passenger Car Chassis Domain Control and Chassis Cross-Domain Integration Research Report, 2026
Chassis Control Research: Mass Production of Full Chassis-by-Wire Solutions Starts
1. A Cluster of Full Chassis-by-Wire Solutions Make Their Debut, and EMB Enters Mass Production and Adoption for the...
Central Domain Control (Powertrain, Chassis, Body) and Motion Controller Research Report, 2026
Central Domain Control and Motion Control Research: XYZ Coordinated Control and Full X-by-Wire Actuation System
With the gradual penetration of L3+ autonomous driving, the chassis control system is ...
48V Low-voltage Power Distribution Network (PDN) Architecture and Supply Chain Panorama Research Report, 2026
Research on 48V Low-Voltage Power Distribution Network (PDN): An Active 48V Supply Chain, with Priority Deployment in High-Power Scenarios Such as Steer-by-Wire Chassis
The automotive 48V low-voltage...
AI-Defined Vehicle (AIDV) OEMs' Deployment Strategies Research Report, 2026
AIDV Research: Deployment Strategies of 22 OEMs
The AI-Defined Vehicle (AIDV) OEMs' Deployment Strategies Research Report, 2026, released by ResearchInChina, analyzes the AI deployment strategies of ...
OEMs’ Passenger Car Model Planning Research Report, 2026
Vehicle Model Planning Research: Chinese OEMs Launch Sub-Brands Intensively, While Multinational OEMs Apply the Brakes to Electrification Strategies
ResearchInChina released the OEMs’ Passenger Car M...
Autonomous Driving Simulation and World Model Research Report, 2026
Autonomous driving simulation research: "Simulation test + world model"-driven test system has become R&D infrastructure.
The "Autonomous Driving Simulation and World Model Research Report, 2026"...
Cockpit-Driving Integration Central Domain Controller SoC and AI Supercomputing Architecture Research Report, 2026
Cockpit-Driving integration and AI supercomputing research: The One Chip solution is rapidly installed in vehicles, and AI supercomputing architectures are moving towards full-domain integration.
AI ...
Intelligent Driving End-to-End Large Model Research Report, 2026
Research on Intelligent Driving Large Models: A Critical Period for Technological Competition and Paradigm Integration
As autonomous driving technology rapidly iterates from L2 to L3?L4, intelligent...
Automotive Digital Key Industry Trend Report, 2026
Digital Key Research: Automotive BLE, UWB and SLE Hardware Layout
The Automotive Digital Key Industry Trend Report, 2026, released by ResearchInChina, analyzes and predicts the digital key market, co...
Monthly Report on Automotive New Technology (May 2026)
UHD gaze technology, full-color LiDAR, UWB, etc. promote the upgrade of intelligent driving perception capabilities
This report is published once a month and is available for annual subscription.The...
In-Cabin Monitoring Systems (DMS, OMS, etc.) Research Report, 2026
In-Cabin Monitoring System Research: DMS to Become Mandatory in 2027, Expected to be Installed in Over 14 Million Vehicles
ResearchInChina released the In-Cabin Monitoring Systems (DMS, OMS, etc.) Re...
Automotive Service-Oriented Architecture (SOA) and Cross-Domain Middleware Industry Report, 2026
Research on automotive SOA and cross-domain middleware: The era of AI atomic services and AI cross-domain fusion agents is coming.
Automotive SOA evolves towards AI + full SOA servitization Driv...