NXP’s Intelligence Business Analysis Report, 2022-2023
  • June 2023
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In 2015, NXP acquired Freescale for USD11.8 billion, hereby becoming the largest automotive semiconductor vendor. Yet NXP's development progress has not always gone smoothly. In 2021, Infineon replaced NXP as the biggest automotive semiconductor vendor.    
In 2022, NXP’s revenue jumped by 19.4% on the previous year to USD13.205 billion, 52% of which was from the Automotive; its net income hit USD2.833 billion, soaring by 48.6%. Despite a good growth, NXP was still positioned second in the industry.  

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NXP S32 Automotive Platform is designed for autonomous driving, involving the perception, decision and actuation. Among NXP's main ADAS chips, S32R is used for radars, S32A for L3~L5 CPUs, S32V for visual processing, S32G for automotive gateways, S32Z/S32E for real-time processing and power domain controller systems, and S32K for small domain controllers and small sub-nodes.

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NXP once worked hard on S32V vision processor and BlueBox ADAS domain controller, but the result was not as expected. By contrast, it succeeded in S32R and S32G.
NXP has gambled on 4D imaging radar and network processor since 2022.
NXP has established a solid foothold in automotive radars for more than 20 years. By 2022, it had launched six generations of radar chips, and has transitioned to RFCMOS as early as the fourth generation. NXP has a leading position in the automotive radar market, offering radar technology to the top 20 automotive OEMs in the world. 
In early 2022, NXP released the industry’s first dedicated 16nm imaging radar processor, the NXP S32R45, which is also the flagship of NXP’s 6th generation automotive radar chipset family. Additionally, the new NXP S32R41 was introduced to extend 4D imaging radar’s benefits to a much larger number of vehicles including high-end cars, vehicles used for mobility services, and mainstream passenger cars. Together these processors serve the L2+ through L5 autonomy sectors, enabling 4D imaging radar for 360-degree surround sensing.
Radar developers such as Hawkeye and Hasco have developed 4D imaging radars based on NXP S32R45.
Based on NXP S32R45, Hasco has developed 4-chip cascaded imaging radar, with a detection range of 350 meters, 1° horizontal resolution, 2° pitch resolution and ±75° FOV, covering more blind spots. Hasco has a high expectation of the prospect that 4D radar will completely replace conventional ordinary radars in the future. LRR30, Hasco’s 4D radar, can output 1,024 4D point clouds and track up to 64 objects. It is one of the first imaging radar sensors to be production-ready in the market. The LRR40 being developed by Hasco can output up to 3,072 4D point clouds and track 128 objects. 

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The layout in vehicle intelligence in recent year reveals that NXP focuses on deploying radar chips and network processors.

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NXP's Thinking on Intelligent Transformation of the Automotive Industry
NXP believes that the automotive industry is building a new triangle value chain. OEMs are mainly responsible for architecture definition and system integration. To this end, they need basic technologies and chip platforms from semiconductor companies, as well as hardware and software integration and software actuation provided by Tier 1 suppliers. NXP aims to gradually step in the triangle value chain as a technical partner. That is to say, a technology company like NXP should have a team that serves Tier 1 suppliers, and another team targeting OEMs. Therefore, in recent years, NXP has been increasing the number of system engineers and software engineers to enhance its complete system-level solutions. In terms of products, NXP is transforming into a chip supplier, that is, it is integrating more software on the basis of chips. NXP’s software engineers have outnumbered hardware engineers. NXP continues system-level investments, in a bid to deeply understand how the automotive architecture develops and evolves. 
Obviously, other automotive chip vendors such as Horizon Robotics are following suit, making the chip toolchain and grouped algorithms as perfect as possible to reduce the chip introduction workload for OEMs and Tier1 suppliers.
The automotive industry is heading towards software-defined vehicles, and it requires brand-new automotive software development methods to handle ECU integration, data-driven automotive services, secure cloud connection and service-oriented architectures. Automakers and Tier1 suppliers are confronted with new challenges in multi-tenancy (one MPU supports multiple virtual MCUs), network management, cloud services, functional safety and advanced safety technology. This makes it extremely difficult for automakers and Tier1 suppliers to introduce automotive intelligent chips. 
NXP’s S32G Vehicle Integration Platform (GoldVIP) provides a reference vehicle integration platform that accelerates S32G hardware evaluation, software development and rapid prototyping efforts. NXP helps address these challenges with GoldVIP’s pre-integrated software, including from partners Airbiquity, Amazon Web Services, Argus Cyber Security and Elektrobit.

GoldVIP has integrated the following software:
Airbiquity OTAmatic client (for OTA updates)
AWS IoT Greengrass V2 edge runtime (for secure cloud services)
Elektrobit tresos AUTOSAR Classic Platform
Argus Cyber Security Intrusion Detection and Prevention System

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Related Reports:
Ambarella’s Intelligent Driving Business Analysis Report, 2022-2023
NXP’s Intelligence Business Analysis Report, 2022-2023
Jingwei Hirain’s Automotive and Intelligent Driving Business Analysis Report, 2022-2023
Continental’s Intelligent Cockpit Business Analysis Report, 2022-2023
Bosch’s Intelligent Cockpit Business Analysis Report, 2022-2023
Baidu’s Intelligent Driving Business Analysis Report, 2022-2023
Aptiv’s Intelligent Driving Business Analysis Report, 2022-2023
ZF’s Intelligent Driving Business Analysis Report, 2022-2023
Continental’s Intelligent Driving Business Analysis Report, 2022-2023
Bosch’s Intelligent Driving Business Analysis Report, 2022-2023
Horizon Robotics’ Business and Products Analysis Report, 2022-2023
Desay SV’s Intelligent Driving Business Analysis Report, 2022-2023
Renesas Electronics’ Automotive Business Analysis Report, 2023
Infineon’s Intelligent Vehicle Business Analysis Report
Haomo.AI’s Intelligent Driving Business Analysis Report
SenseTime’s Intelligent Vehicle Business Analysis Report

1 Introduction to NXP
1.1 Profile
1.1.1 Development History
1.2 Financial Status
1.2.1 Financial Status in China
1.3 R&D Layout in China
1.4 Latest Dynamics
1.5 ADAS/AD Products
1.6 S32 Family Chips Support Software-defined Vehicles
1.7 Software Tools and Ecosystem
1.8 New Partnerships in the Transformation of Automotive Industry

2 Autonomous Driving Computing Platform
2.1 BlueBox Autonomous Driving Computing Platform
2.1.1 Bluebox 1.0
2.1.2 BlueBox 2.0
2.1.3 BlueBox 3.0
2.1.4 Framework of BlueBox 3.0
2.1.5 Application Scenarios of BlueBox
2.2 Layerscape LX2160A Processor

3 Sensor Chips
3.4 S32 Automotive Platform
3.1.1 End-to-end Solutions
3.1.2 ADAS Processor Solutions
3.2 S32R Radar Processor
3.2.1 Evolution of Radars
3.2.2 S32R4x 4D Imaging Radar MCU
3.2.3 S32R4x Three-in-one Imaging Radar
3.2.4 S32R45 4D Imaging Radar Processor
3.2.5 Parameters of S32R45 4D Imaging Radar Processor
3.2.6 S32R41 4D Imaging Radar Processor
3.2.2 S32R294 Radar MCU
3.2.8 TEF82xx 77GHz Automotive Radar Transceiver 
3.2.9 S32R41 and TEF82xx Development Platforms
3.2.10 S32R41+TEF82 Software Support
3.2.11 Framework of S32R41+ TEF82
3.2.12 77GHz Radar Transceivers: TEF810X
3.2.13 77GHz Radar Transceivers: MR3003 
3.2.14 Radar Chip Comparison
3.2.15 SAF85xx 4D Radar Chip
3.2.16 Cases of Radar Partners (1)
3.2.17 Cases of Radar Partners (2)
3.3 S32V Vision Processor
3.3.1 S32V234 Processor
3.3.2 S32V2 Solution
3.3.3 S32V3 Processor

4 Automotive Network Processors and Control Processors
4.1 S32G Family 
4.1.1 Parameters of S32G Family Products 
4.1.2 S32G System Solutions and Hardware Platforms
4.2 S32G2 Processors
4.3 S32G3 Processors
4.3.1 Diagram Frame of S32G399A  
4.3.2 Target Applications of S32G3
4.3.3 Comparison between S32G2 and S32G3
4.3.4 Application Cases of S32G3
4.3.5 Ecosystem of S32G3 Partners 
4.3.6 S32G GoldVIP
4.3.7 Cooperation between NXP and AWS
4.4 S32Z/S32E Vehicle Control Processors
4.4.1 Features of S32Z/S32E
4.4.2 S32Z2
4.4.3 S32E2
4.4.4 Roadmap of Real-Time Processors
4.4.5 Different Positioning of S32K/S32Z/S32G
4.5 OrangeBox Development Platform
4.6 GoldBox Development Platform
4.7 Zone Solutions
4.8 Zone Controller Solutions

5 V2X and CVIS
5.1 V2X Product Layout
5.2 SAF5400 Single Chip Modem
5.2.1 Architecture of SAF5400 Single-Chip Modem
5.3 RoadLINK Chipset System Framework Diagram
5.4 SXF1800 V2X Secure Element
5.5 V2X Wireless Processors

6 Automotive MCU
6.1 Active Suspension MCU
6.2 MCU for Electric Power Steering (EPS)
6.3 MCU for Braking and Stability Control
6.4 S32K MCU
6.4.1 S32K Cooperation Ecosystem 
6.4.2 S32K3 for T-box
6.4.3 S32K3 for Motor Control
6.4.4 S32K39 Series 

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