Next-generation Central and Zonal Communication Network Topology and Chip Industry Research Report, 2026-2027

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Research on Zonal Communication Topology: New Architectures Including 10 BASE-T1S+RCP, AVB/TSN Ethernet Are Under Rapid Development

Vehicle communication networks are mainly divided into in-vehicle networks and off-vehicle networks. This report focuses on the development and application scenarios of in-vehicle communication technologies.

Backbone Network: 10 GbE Ethernet is being deployed onboard, with implementation paths including copper-cable Ethernet 10G BASE-T1 and automotive optical communication (optical fiber Ethernet, passive optical network / PON);
Local Edge Nodes: 10 BASE-T1S and CAN-XL are being introduced to vehicles. The 10 BASE-T1S+RCP solution enables MCU-Less edge nodes;
High-speed Video Communication: 10G+ SerDes is being adopted onboard. Open protocols have become an irresistible trend, while major proprietary protocols such as GMSL and FPD-Link are converging toward open standards;
Automotive Audio Communication: A2B 2.0 coexists and competes with AVB/TSN Ethernet. In the short term, a hybrid layered network architecture of “AVB/TSN Ethernet backbone + A2B 2.0 audio spur” will be adopted. Full-vehicle Ethernet adaptation represents the main trend, and A2B 2.0 is being actively optimized for Ethernet architectures.

Edge Nodes: 10 BASE-T1S+RCP to realize edge MCU-Less

RCP (Remote Control Protocol) is a lightweight communication protocol built on 10BASE-T1S. It enables zone controllers / central computing platforms to remotely control edge nodes such as automotive Ethernet-based sensors and actuators directly. RCP and 10BASE-T1S are technologies at different layers that work in coordination: 10BASE-T1S is the IEEE-standardized physical layer (PHY) transmission medium, while RCP is the protocol layer running on top of 10BASE-T1S. They are not alternatives to each other, but a combination of underlying bearer and upper-layer application.

The core design philosophy of RCP is to leverage 10BASE-T1S and migrate computing, control logic and protocol conversion functions originally distributed across individual edge MCUs to zone controllers / central computing platforms. Edge nodes only retain basic I/O driver functions and become remotely accessible peripherals. This replaces the traditional distributed “MCU + gateway” architecture, achieves MCU elimination at edge nodes, and facilitates the smooth evolution of the E/E architecture toward the ultimate form of central computing platform + zone gateway.

In current industry implementations, “RCP + 10BASE-T1S” is often packaged as a deployment solution known as the “Ethernet Edge Bus”. The entire transmission link is simplified into a flat, minimal architecture: “HPC/ZCU → 10BASE-T1S SPE Bus → RCP Endpoint Chip → Sensor/Actuator“. Under this design, protocol conversion is fully offloaded to upper-layer controllers; edge nodes only need to parse and execute instructions in compliance with the RCP protocol specification.

The OPEN Alliance TC18 Working Group defines a master-slave Client-Server model for RCP connections:

ZCU (Zone Controller) / HPC (High Performance Computing Platform) as RCP Master (Client): The application-layer RCP Client inside the ZCU/HPC converts control operations into SPI commands, encapsulates them into RCP frames, and dispatches register read/write commands over 10BASE-T1S;
Edge RCP Chip as Slave (Server): The RCP endpoint chip integrates a hardware protocol parsing engine. Frames are parsed directly in hardware to output low-level drive signals for peripheral control, and operations can be executed via SPI. Local protocol conversion is eliminated, so edge-side MCUs for running protocol stacks and firmware deployment are no longer required.

In terms of standardization, the core RCP specification has been released internally within the Open Alliance, though formal standards are not yet finalized. Protocol fields and frame encapsulation solutions for RCP are still under standardization discussion and refinement. RCP was first proposed by BMW at the OPEN Alliance TC14 meeting in May 2023. In April 2024, the OPEN Alliance released RCP Protocol Draft 0.2. In July 2024, the OPEN Alliance established the TC18 Working Group dedicated to RCP standardization. In March 2026, a PAR submission was made to IEEE 1722, opening the opportunity for RCP to become an international standard and resolve the interoperability pain point of incompatible RCP chips from different vendors.

In practical deployment, the 10BASE-T1S+RCP solution is first piloted on a small scale for low-complexity, low-node-count functions such as interior ambient lighting, lamp control, door/window control and seat control. Safety-critical nodes with high ASIL levels including powertrain, braking and steering require ultra-low-latency closed-loop control and will not fully adopt the MCU-Less RCP architecture in the short term. Safety mechanisms and redundancy design require separate evaluation.

Take the onsemi MCU-Less lamp control solution built on RCP as an example. A conventional matrix LED headlamp design requires a dedicated MCU on the lamp board to parse CAN bus commands, run logic algorithms and drive LED light sources. With RCP technology, onsemi enables MCU-Less dynamic lighting control and OTA updates. The zone controller sends commands directly over the 10BASE-T1S network to control the LED driver of the lamp module, realizing MCU-Less lamp control. This cuts BOM costs for lamp-side MCUs and gateways, greatly simplifies the lamp PCB hardware design and reduces module size. Meanwhile, intelligent lamp control logic is centrally migrated to the central computing unit. Leveraging the powerful computing capability of zone controllers and central computers, software-defined lighting functions can be flexibly implemented. This flat architecture of "HPC – 10BASE-T1S Ethernet – RCP Chip – LED Driver" delivers substantial cost reduction and efficiency gains, facilitates hardware-software decoupling and significantly enhances OTA upgrade capability.

Automotive Audio Stream: Hybrid Network Architecture of AVB/TSN Ethernet Backbone + A2B 2.0 Audio Spur

AVB/TSN Ethernet reuses the existing automotive Ethernet backbone to connect distributed audio systems based on ZCUs

Automotive audio architectures are gradually shifting from traditional centralized audio toward distributed audio under the Zonal architecture. Under the Zonal framework, the vehicle is partitioned into front, left, right, rear and other zones. Amplifier functions are distributed into ZCUs, eliminating dedicated amplifier ECUs, while speakers are connected locally to ZCUs — a direction widely explored across the industry.

Centralized Audio Architecture: Amplifier chips are concentrated inside a single ECU, and dedicated amplifiers connect speakers across the cabin via wiring harnesses, with transmission mainly relying on the proprietary A2B protocol.
Distributed Audio Architecture: Amplifiers are embedded within zone controllers (ZCUs). The cockpit SoC handles audio algorithm decoding, and digital audio is transmitted over AVB+TSN Ethernet to drive nearby speakers, supporting flexible management, synchronized transmission and personalized audio experience across multiple zones.

This architectural optimization effectively shortens speaker harness length, substantially reduces harness weight and routing complexity. While maintaining system functionality, it cuts hardware BOM cost, vehicle manufacturing cost and curb weight. It also better enables software-defined audio and supports flexible platform iteration across vehicle models. Multiple vendors have launched distributed audio solutions based on AVB+TSN Ethernet.

ST’s distributed audio solution serves as an example. In January 2026, STMicroelectronics and AutoCore jointly launched a zone-controller-based distributed audio solution centered on the Stellar G series MCU. Amplifier units are distributed and integrated into each zone controller, with speakers connected locally to ZCUs, greatly shortening harness length and reducing harness weight and complexity. This solution completely removes traditional external dedicated amplifiers and the A2B bus. The automotive Ethernet backbone replaces traditional A2B audio wiring; audio data is transmitted over the reused Ethernet backbone without additional dedicated audio cables. Supported by TSN and AVB technologies and an integrated high-performance TSN protocol stack, the cockpit SoC establishes high-precision synchronized audio transmission channels with ZCUs distributed across the vehicle body, achieving nanosecond-level clock synchronization and enabling low-latency, low-jitter synchronized playback for all cabin speakers.

A2B 2.0 Emerges as the Primary Connection for Audio Edge Nodes and Is Actively Adapted to Ethernet Architectures

Meanwhile, A2B itself is evolving. As vehicles are equipped with growing numbers of microphones and speakers and ANC/RNC systems are widely deployed, the 50 Mbps bandwidth of the A2B 1.0 bus has become insufficient. Its 32 audio channels are also constrained: one RNC node may occupy 3 channels, and 4 RNC nodes in a vehicle consume 12 channels, leaving limited headroom for microphones and speakers. Furthermore, A2B 1.0 cannot support sampling rates raised from 44.1 kHz to 96 kHz.

To maintain the competitiveness of the A2B ecosystem, ADI released A2B 2.0 in April 2026. As an upgrade to A2B, A2B 2.0 retains compatibility with A2B 1.0 cables and connectors. Thanks to higher functional integration, simplified external circuits and fewer external components, system cost can be reduced by up to 30%. A2B 2.0 is also Ethernet-compatible and supports 10 Mbps Ethernet data tunneling via the Open Alliance SPI (OASPI) interface. The A2B 2.0 family (ADAA245x series) is now in full mass production.

Higher Bandwidth and Scalability: A2B 2.0 features a full-duplex bandwidth upgraded to 98.3 Mbps, delivering around 4× overall capability improvement versus the prior generation to support advanced automotive audio architectures. It supports 119 audio channels to meet the configuration requirements of premium automotive audio systems.
Ethernet Compatibility: 10 Mbps Ethernet data tunneling is realized through the industry-standard Open Alliance SPI (OASPI) interface to enhance connectivity and flexibility. If remote nodes require Ethernet upgrade in the future, the traffic can be carried over the A2B 2.0 bus, with 10 Mbps reserved for Ethernet within the 100 Mbps bandwidth pool, eliminating the need for separate Ethernet cabling. This reduces harness complexity for OEMs while reserving OTA channels for remote nodes.
Bus and Daisy-Chain Topology Retained: A2B 2.0 remains a bus-based daisy-chain architecture. One master node connects multiple child nodes, which can be speakers or bridged A2B 1.0 chips. The maximum communication distance is 80 meters, and the child-node segment distance is 25 meters, covering the requirements of all vehicle types.
Physical Layer Compatibility: A2B 2.0 still uses UTP (unshielded twisted pair) cabling and is fully backward-compatible with A2B 1.0; no connector replacement is required, only impedance matching. Clock circuits are also simplified for leaner peripheral design.

A2B 2.0 inherits ADI’s mature and long-established audio ecosystem and can interface seamlessly with existing systems without extra development investment. The ADAA2455 / ADAA2456 / ADAA2457 form a family of 100 Mbps A2B 2.0 transceivers: ADAA2455 is a low-cost slave transceiver, while ADAA2457 integrates the OASPI interface.

Based on ADAA2457, one master node can drive a bus supporting up to 11 child nodes. External interfaces include the OASPI interface for Ethernet and 8 flexibly configurable I/O ports for audio peripherals such as I2S, TDM and PDM. Digital microphones and other edge devices can be directly attached to the A2B bus, removing the overhead of MCUs and software development. This plug-and-play capability makes the integration of vehicle audio systems more efficient and streamlined.

Automotive Cameras: Innovative Integrated Bridging Architecture — CIS with Embedded Serializer to Cut SerDes Count

Current automotive camera modules generally adopt a discrete bridging architecture with external SerDes, requiring a standalone serializer chip alongside each image sensor. As autonomous driving levels advance and vehicles carry more and higher-performance cameras, the limitations of this discrete approach become prominent, with urgent demands for optimization in PCB footprint, power consumption and signal integrity. Efficient transmission of massive video data inside shrinking camera modules operating under harsh conditions has become a key industry focus.

Driven by the development of the MIPI A-PHY standard, automotive camera architectures are undergoing a new round of evolution. The industry is exploring the integration of high-speed connectivity functions, traditionally implemented by external serializers, directly inside image sensors. Data converted from CMOS output is transmitted straight to the AD domain controller / central computing platform. Embedding serialization inside the image sensor eliminates discrete serializer chips, further boosting camera module integration, cutting power draw and heat generation, and simplifying manufacturing processes.

A CIS with integrated serializer means future vehicle cameras may no longer require standalone serializer chips. A single integrated device handles both light sensing and data transmission, delivering lower cost, smaller form factor, reduced power consumption and simpler transmission links.

From the vehicle-level perspective, embedding the serializer inside the CIS removes one IC as well as associated high-speed differential traces and power circuits within the module. It saves procurement cost for the SerDes chip, reduces aluminum heat sink material inside the module, and lowers reflow soldering cycle time and defect rates. For intelligent vehicles equipped with 8–12 cameras, such system-level cost reduction carries far greater impact than a marginal per-chip price cut. It brings tangible cost savings and weight reduction for camera lenses packaged in tight spaces such as rearview mirrors, fenders and B-pillars.

As camera SerDes migrates from “discrete add-on chip” to “sensor-embedded block”, the market for standalone SerDes chips will shrink substantially. When SerDes evolves from a separately sold hardware chip to an embedded IP block inside sensors, chip vendors currently focused on discrete SerDes will inevitably shift their revenue model from pure hardware margin to technology licensing, IP royalty sharing or co-development. They will either expand upstream into the sensor domain or tightly couple downstream with computing platforms. The traditional business model of simply selling paired SerDes chips will become increasingly unsustainable.

Current CIS+serializer integration initiatives are led by CIS vendors (Sony, onsemi, SmartSens, etc.). CIS suppliers are exploring “native link” solutions in partnership with A-PHY vendors. Despite remaining challenges in protocol compatibility and alignment with OEMs’ long-established communication ecosystems in the early stage, the trend toward interface integration is irreversible.

Take SmartSens’ CIS+ISP+SerDes integrated solution as an example. In September 2026, domestic CIS vendor SmartSens released SC365AT, the world’s first 3 MP automotive CMOS image sensor integrating SerDes and on-chip ISP. Built on SmartSens’ CARSens?-XR Gen 2 process platform, SC365AT adopts a 3.0 μm single-pixel design and stacked BSI architecture. Equipped with core technologies including CARLofic HDR? and LFS (LED Flicker Suppression), it delivers high frame rate, high sensitivity and wide dynamic range.

Built-in SerDes: Effectively simplifies hardware design of automotive vision systems. No extra serializer chip is required, enabling end-to-end high-speed direct connection from CIS image capture to domain controller processing.
On-chip ISP: Integrates self-developed LTM, PWL, CIP and other image processing algorithms, covering the full ISP pipeline across RAW, RGB and YUV domains. It optimizes dynamic range, noise suppression and color reproduction for complex in-vehicle lighting conditions.
Deep collaboration between on-chip ISP and embedded automotive SerDes: Combines image acquisition, processing and transmission into one device, forming a complete high-speed link from optical input to serialized data output.

1 Central + Zonal Communication Topology Architecture
1.1Overview of In-Vehicle Communication Networks
Classification System and Technical Overview (1)
Classification System and Technical Overview (2)
Classification System and Technical Overview (3)

1.2 Evolution Trend of Vehicle E/E Architecture
Development Evolution
Penetration of Chinese Local Passenger Car Central Computing Architecture, 2023-2030E
Communication Bandwidth Will Increase by Orders of Magnitude Under Central + Zonal Architecture
E/E Architecture Evolution Trend in future 3-5 years (1)
E/E Architecture Evolution Trend in future 3-5 years (2)

2 Evolution Trend Analysis of In-Vehicle Communication (By Segmented Application Scenarios)
2.1 Communication Requirements for Intelligent Driving Scenarios
2.1.1 Communication Link of ADAS Camera
On-Board Camera: Video Stream Link
360° Panoramic Surround View System: Complete Communication Link
Connection Topology Between On-Board Camera and Domain Controller
Mainstream Communication Technology for On-Board Cameras at Present Stage
Traditional Bridging Architecture of On-Board Camera SerDes – Discrete Type
Innovative Bridging Architecture of On-Board Camera SerDes – Integrated Type (1)
Innovative Bridging Architecture of On-Board Camera SerDes – Integrated Type (2)
Innovative Bridging Architecture of On-Board Camera SerDes – Integrated Type (3)
Summary of Integrated Bridging Solutions for On-Board Camera SerDes
On-Board Camera- Integrated SerDes Bridging Solution 1
On-Board Camera- Integrated SerDes Bridging Solution 2
On-Board Camera- Integrated SerDes Bridging Solution 3
On-Board Camera- SerDes Communication Solution (1)
On-Board Camera- SerDes Communication Solution (2)
On-Board Camera- SerDes Communication Solution (3)
On-Board Camera- Future Communication Technology Route 1
Summary of Ethernet Communication Solutions for On-Board Cameras
On-Board Camera- Ethernet Communication Solution 1:
On-Board Camera- Ethernet Communication Solution 1
On-Board Camera- Ethernet Communication Solution 2
On-Board Camera- Ethernet Communication Solution 3
On-Board Camera- Future Communication Technology Route 2
Summary of Optical Communication Solutions for On-Board Cameras
On-Board Camera- Optical Communication Solution 1
On-Board Camera- Optical Communication Solution 2: In-Vehicle Fiber Camera Based on KD7251 Optical Transceiver Replicates Identical Information Through Different Channels
On-Board Camera- Optical Communication Solution 3
On-Board Camera- Optical Communication Solution 4
On-Board Camera – Optical Communication Solution 5: Leopard Imaging 10GBASE-AU Automotive-Grade Fiber Camera System

2.1.2 Communication Links of Radar
Radar: Impacts of Computing Architecture Evolution on Communication Requirements
3D Radar- Edge-Side Processing Architecture: Data Transmission Link
4D Imaging Radar- Transitional Processing Architecture: Data Transmission Link
Satellite Radar – Hybrid Processing Architecture: Data Transmission Link
Satellite Radar – Centralized Processing Architecture: Data Transmission Link
Satellite Radar: Rate Requirements for Common Transceiver Configurations
Millimeter-Wave Radar – Mainstream Communication Technologies at Present Stage
Millimeter-Wave Radar- Future Communication Technology Route 1
Millimeter-Wave Radar- Future Communication Technology Route 2
Millimeter-Wave Radar- Future Communication Technology Route 3
Millimeter-Wave Radar- SerDes Communication Solution 1: BYD New-Generation Automotive-Grade 4D  Radar Chip Equipped with CSI-2 Interface (1)
Millimeter-Wave Radar- SerDes Communication Solution 1: BYD New-Generation Automotive-Grade 4D  Radar Chip Equipped with CSI-2 Interface (2)
Millimeter-Wave Radar – SerDes Communication Solution 2
Millimeter-Wave Radar – SerDes Communication Solution 3
Millimeter-Wave Radar – SerDes Communication Solution 4
Millimeter-Wave Radar – SerDes Communication Solution 5
Millimeter-Wave Radar – SerDes / 1G Ethernet Communication Solution 1
Millimeter-Wave Radar – SerDes / 1G Ethernet Communication Solution 2
Millimeter-Wave Radar – CAN-XL Communication Solution

2.1.3 Communication Link of LiDAR
Current LiDAR Architecture: Data Transmission Link
Satellite LiDAR Architecture: Data Transmission Link
LiDAR- Future Communication Technology Route 1
LiDAR- Future Communication Technology Route 2
LiDAR- SerDes Communication Solution 1
LiDAR- SerDes Communication Solution 2
LiDAR- Optical Communication Solution 1
LiDAR- Optical Communication Solution 2

2.1.4Communication Link of Ultrasonic Radar
Slave + Master Architecture
Direct Connection to Domain Controller Architecture
Mainstream Communication Technologies at Present Stage
Future Communication Technology Route
DSI2 Communication Solution

2.2  Communication Requirements for Intelligent Cockpit Scenarios
2.2.1 On-Board Display:
Data Transmission Link
Short-Range Display Interface Types
Long-Range Display Interface Types
Resolution and Bandwidth Requirement Analysis
Mainstream Communication Technology at Present Stage
Summary of SerDes Application Requirements for Different On-Board Displays (1)
Summary of SerDes Application Requirements for Different On-Board Displays (2)
Summary of SerDes Application Requirements for Different On-Board Displays (3)
Display SerDes vs Camera SerDes: Core Application Differences
Display SerDes: SerDes Selection Solution Taking 4K Display as an Example
Display SerDes: Technology Development Trend
SerDes Communication Solution 1
SerDes Communication Solution 2
SerDes Communication Solution 3
SerDes Communication Solution 4
Future Communication Technology Route 1
Optical Communication Solution 1
Optical Communication Solution 2

2.2.2 Automotive Audio
Data Transmission Link
Automotive Audio Architecture
Automotive Audio Transmission Bus
Mainstream Communication Technology at Present Stage
Future Communication Technology Route 1
Future Communication Technology Route 2
AVB/TSN EthernetA2B vs AVB/TSN Ethernet
A2B Transmission Solution
A2B 2.0 Transmission Solution
AVB/TSN Ethernet Transmission Solution 1
AVB/TSN Ethernet Transmission Solution 2
AVB/TSN Ethernet Transmission Solution 3

2.3 Communication Requirements for Body (Zonal) Domain Scenarios
2.3.1 ZCU
Two Routes for Zonal Architecture in the Next Stage
Development Direction of Zonal Controllers in the Next Stage
Comparison of Three Zonal Controller Product Form Factors
Application Logic of I/O Zonal Controllers Under Fully Centralized Integrated Architecture
Construction of ZCU Communication Network (1)
Construction of ZCU Communication Network (2)
Communication Between ZCU and External Devices (Backbone Network)
Intra-Zone Communication of ZCU (Local Low-Speed Applications)
Intra-Zone Communication of ZCU (Sensor Communication)
Future Communication Technology Route 1
Future Communication Technology Route 2
Optical Fiber ZCU
ZCU Optical Communication Network Architecture:  Summary of Vendors and Solutions
ZCU Optical Communication Solution (1)
ZCU Optical Communication Solution (2)
ZCU Optical Communication Solution (3)
ZCU Optical Communication Solution (4)
ZCU Optical Communication Solution (5)
ZCU Optical Communication Solution (6)
ZCU Optical Communication Solution (7): Poncan Semiconductor Next-Generation Smart Vehicle Optical Network Platform Architecture Based on TS-PON

2.3.2 Automotive Lighting
ADB Adaptive Driving Beam:  Data Transmission Link
DLP Digital Projection Headlamp: Data Transmission Link
Micro-LED Projection Headlamp: Data Transmission Link
Headlamp Zonal Control Architecture (MCU-Less)
Automotive Taillight: Communication Link and Architecture
Automotive Lighting- CAN Communication Solution
Automotive Lighting- CAN-FD Communication Solution
10Base-T1S Communication Solution (1)
10Base-T1S Communication Solution (2)
10Base-T1S Communication Solution (3)
10Base-T1S Communication Solution (4)

2.3.3 Edge Node/Actuator
Edge Node Type 1
Edge Node Type 2
Mainstream Communication Technology at Present Stage
Future Communication Technology Route 1
Future Communication Technology Route 2
10Base-T1S Communication Solution (1)
......
10Base-T1S Communication Solution (6)

2.4 Vehicle?Control?Communication?Scenarios
2.4.1 BMS
BMS Topology
Wired BMS Communication Links
Wired BMS- Mainstream Communication Technology at Present Stage and Architecture
Wired BMS- Future Communication Technology Route 1
Wired BMS- Daisy Chain Communication Solution
Wired BMS-10M Ethernet Communication Solution
Wired BMS- Communication Application Case
Wireless BMS Communication Architecture
wBMS Communication Performance Indices
wBMS Communication Topology and Evolution Trend
wBMS- Mainstream Communication Technology at Present Stage
wBMS- Future Communication Technology Route 1
wBMS- Future Communication Technology Route 2
wBMS- Bluetooth LE Communication Solution 1
wBMS- Bluetooth LE Communication Solution 2
wBMS- UWB Communication Solution

2.4.2 Chassis-by-Wire?System
Communication Links for L2+ Chassis-by-Wire?System
Communication Links for L3/L4 Chassis-by-Wire?System
Communication Architecture for L3/L4 Chassis-by-Wire?System
Communication Links for L5 Chassis-by-Wire?System
Communication Architecture for L5 Chassis-by-Wire?System
Communication Architecture Design 1: Hierarchical Hybrid Architecture
Communication Architecture Design 2: Dual Communication Redundancy Technology
EMB Brake-by-Wire Communication Redundancy Solution
Steer-by-Wire 10BASE-T1S Communication Solution

3 Evolution Trend Analysis of In-Vehicle Communication (By Technical Type)
3.1 In-Vehicle Backbone Network Communication Technologies (Copper Cable)
3.1.1 100/1000 BASE-T1
In-vehicle Backbone Communication at Present Stage
Trends of Automotive Ethernet Switch Chips
List of Automotive MCU Products with Integrated Ethernet Switch
Automotive MCU Product 1 with Integrated Ethernet Switch
Automotive MCU Product 2 with Integrated Ethernet Switch
Overseas and Domestic 100/1000Mbps In-Vehicle Ethernet PHY Chip Vendors and Product Selection (1)
Overseas and Domestic 100/1000Mbps In-Vehicle Ethernet PHY Chip Vendors and Product Selection (2)
......
Overseas and Domestic 100/1000Mbps In-Vehicle Ethernet PHY Chip Vendors and Product Selection (6)
100/1000BASE-T1 Ethernet PHY Chip Products
100/1000BASE-T1 Application Case 1
......
100/1000BASE-T1 Application Case 4

3.1.2 2.5G Ethernet
Next-Generation In-Vehicle Ethernet: 2.5G Ethernet Ring Network
Cost Comparison Between 2.5G Ethernet and Gigabit Ethernet
2.5G Ethernet Product Development Roadmap: Suppliers and Products
2.5G Ethernet Product Solution (1)
2.5G Ethernet Product Solution (2)
2.5G Ethernet Product Solution (3)

3.1.3 10G Ethernet
Flagship Models Start Deploying 10GBASE-T1
Requirements for Switches in 10G Ethernet Backbone Network (1)
Requirements for Switches in 10G Ethernet Backbone Network (2)
10G In-Vehicle Ethernet PHY Chip Vendors and Product Selection
10G In-Vehicle Ethernet Switch Chip Vendors and Product Selection (1)
10G In-Vehicle Ethernet Switch Chip Vendors and Product Selection (2)
10G In-Vehicle Ethernet Switch Chip Vendors and Product Selection (3)
10G In-Vehicle Ethernet Chip Product 1
10G In-Vehicle Ethernet Chip Product 2
10G In-Vehicle Ethernet Application Case 1
10G In-Vehicle Ethernet Application Case 2

3.1.4 Market Pattern and Market Size of In-Vehicle Ethernet Chips
Domestic Automotive Ethernet Chip Market Competition Landscape (1)
Domestic Automotive Ethernet Chip Market Competition Landscape (2)
On-board Ethernet PHY and Switch Chip Loading Volume for Passenger Cars at Different Autonomous Driving Levels
China Passenger Car Ethernet PHY Chip Demand and Market Size, 2023-2030E (1)
China Passenger Car Ethernet PHY Chip Demand and Market Size, 2023-2030E (2)
China Passenger Car Ethernet Switch Chip Demand and Market Size, 2023~2030E

3.2 In-Vehicle Backbone Network Communication Technologies (Optical Fiber Communication)
In-Vehicle Optical Fiber Communication: Definition
Technical Routes of In-Vehicle Optical Communication: Fiber Ethernet & Optical PON
Comparison Between In-Vehicle Optical Ethernet and In-Vehicle Optical PON (1)
Comparison Between In-Vehicle Optical Ethernet and In-Vehicle Optical PON (2): Communication Mode
Comparison Between In-Vehicle Optical Ethernet and In-Vehicle Optical PON (3): Board-Level Form
In-Vehicle Optical Fiber Communication: Key Technologies and Technical Challenges
Application Panorama of In-Vehicle Optical Fiber Communication
Implementation Scenarios for In-Vehicle Optical Fiber Communication (1)
Implementation Scenarios for In-Vehicle Optical Fiber Communication (2)
Requirements for Optical Communication in High-Speed Communication Scenarios
Maturity of In-Vehicle Optical Fiber Communication Industrial Chain (1)
Maturity of In-Vehicle Optical Fiber Communication Industrial Chain (2)
Maturity of In-Vehicle Optical Fiber Communication Industrial Chain (3)
Maturity of In-Vehicle Optical Fiber Communication Industrial Chain (4)
Maturity of In-Vehicle Optical Fiber Communication Industrial Chain (5)

3.2.1 In-Vehicle Fiber Ethernet
System Composition and Transmission Principle
Differences from Copper-Based Electrical Ethernet
Optical Communication Solution Selection and Advantages
Product Development Roadmap
Summary of Industrial Chain Vendors and Product Solutions (1)
Summary of Industrial Chain Vendors and Product Solutions (2)
Summary of Industrial Chain Vendors and Product Solutions (3)
Summary of Industrial Chain Vendors and Product Solutions (4)
Summary of Industrial Chain Vendors and Product Solutions (5)
Product Analysis of In-Vehicle Fiber Ethernet (1)
Product Analysis of In-Vehicle Fiber Ethernet (2)
Product Analysis of In-Vehicle Fiber Ethernet (3)
Product Analysis of In-Vehicle Fiber Ethernet (4)
Product Analysis of In-Vehicle Fiber Ethernet (5)
Product Analysis of In-Vehicle Fiber Ethernet (6): KD EVB9351-SFP Pluggable Module

3.2.2 Passive Optical PON
Passive Optical PON: Definition and System Composition
In-Vehicle Optical PON Technical Routes: V-PON, TSN/TS-PON
In-Vehicle V-PON: Structural Composition
In-Vehicle V-PON: In-Vehicle Application Architecture Topology
In-Vehicle V-PON: Technical Comparison with Traditional PON Networks
In-Vehicle V-PON: Application Advantages
In-Vehicle V-PON: Standards and Industrial Development
In-Vehicle TSN/TS-PON: Definition
In-Vehicle TSN/TS-PON: Network Topology
In-Vehicle TSN/TS-PON: Architecture Comparison with Traditional PON
Technical Features of In-Vehicle TSN/TS-PON: Low Latency, High-Precision Synchronization and High Reliability
In-Vehicle TSN/TS-PON: Large-Scale Commercialization Evolution Path
In-Vehicle TSN/TS-PON: Standard Progress
In-Vehicle Optical PON: Challenges for Vehicle Deployment (1)
In-Vehicle Optical PON: Challenges for Vehicle Deployment (2)
In-Vehicle Optical PON: Challenges for Vehicle Deployment (3)
In-Vehicle Optical PON: Summary of Industrial Chain Vendors and Product Solutions (1)
In-Vehicle Optical PON: Summary of Industrial Chain Vendors and Product Solutions (2)
In-Vehicle Optical PON: Summary of Industrial Chain Vendors and Product Solutions (3)
In-Vehicle Optical PON: Summary of Industrial Chain Vendors and Product Solutions (4)
Chip Product Analysis of In-Vehicle Optical PON (1)
Chip Product Analysis of In-Vehicle Optical PON (2)
Chip Product Analysis of In-Vehicle Optical PON (3)
Chip Product Analysis of In-Vehicle Optical PON (4)
Equipment Products of In-Vehicle Optical PON
Optical Fiber and Cable Solution for In-Vehicle Optical PON
In-Vehicle Optical PON Solution (1)
In-Vehicle Optical PON Solution (2)

3.2.3 In-Vehicle Optical Fiber Backbone Network Application Summary
Demand for Optical Fiber Communication in In-Vehicle Backbone Networks
In-Vehicle Optical Fiber Backbone Network: Architecture Composition
In-Vehicle Optical Fiber Backbone Network: Comparison with Copper Ethernet Backbone Network
In-Vehicle Optical Fiber Backbone Network: Application Topology Built on Fiber Ethernet
In-Vehicle Optical Fiber Backbone Network: Application Topology Built on Passive Optical PON
In-Vehicle Optical Communication Network Architecture: Optoelectronic Hybrid Architecture as Mainstream (1)
In-Vehicle Optical Communication Network Architecture: Optoelectronic Hybrid Architecture as Mainstream (2)
In-Vehicle Optical Communication Network Architecture: Summary of Vendors and Solutions
In-Vehicle Optical Communication Network Architecture Solution (1)
In-Vehicle Optical Communication Network Architecture Solution (2)
In-Vehicle Optical Communication Network Architecture Solution (3)
In-Vehicle Optical Communication Network Architecture Solution (4)
In-Vehicle Optical Communication Network Architecture Solution (5)
In-Vehicle Optical Communication Network Architecture Solution (6)
In-Vehicle Optical Communication Network Architecture Solution (7)

3.2.4 In-Vehicle Optical Fiber Communication (High-Speed Video Stream) Application Summary
Future In-Vehicle High-Speed Video Stream Communication Technology
In-Vehicle High-Speed Video Stream: Solution of Replacing SerDes with Optical Fiber
In-Vehicle Fiber Camera: Structural Principle
In-Vehicle Fiber Camera: Differences from Traditional Cameras
In-Vehicle Fiber Camera: Summary of Vendors and Solutions
In-Vehicle Fiber Camera Solution (1)
In-Vehicle Fiber Camera Solution (2)
In-Vehicle Fiber Camera Solution (3)
In-Vehicle Fiber Camera Solution (4)
In-Vehicle Fiber Camera Solution (5)
In-Vehicle Optical Transmission Display: Structural Principle and Summary of Product Solutions
In-Vehicle Optical Transmission Display Solution (1)
In-Vehicle Optical Transmission Display Solution (2)

3.2.5 Market Size of In-Vehicle Optical Communication Systems and OEM Layout
Market Size of In-Vehicle Optical Communication Systems for China Passenger Cars (Excluding Import and Export), 2023-2030E
In-Vehicle Optical Communication: Summary of OEM Layout (1)
In-Vehicle Optical Communication: Summary of OEM Layout (2)
OEM Layout 1
OEM Layout 2
OEM Layout 3
OEM Layout 4

3.3 In-Vehicle Low-Speed Communication Technologies
3.3.1 10 BASE-T1S
Three PHY Configurations for 10BASE-T1S Nodes
Core Technology of 10BASE-T1S: Adoption of PLCA (Physical Layer Collision Avoidance) Mechanism
10BASE-T1S+RCP: Realizing MCU-Less Edge Nodes
RCP (Remote Control Protocol): Definition and Working Principle
RCP: Relationship with 10BASE-T1S
RCP: Core Capabilities
RCP: Master-Slave Client-Server Model
RCP: Bus Topology Support
RCP: Standardization Progress
RCP: Application Scenarios
10BASE-T1S+RCP Application Link
10BASE-T1S+RCP Solution: Commercialization Timeline
Summary of Edge Node Protocol Roadmaps of 10BASE-T1S Chip Vendors
10BASE-T1S Edge Node Protocol Roadmap 1 (ADI)
10BASE-T1S Edge Node Protocol Roadmap 2 (TI)
Summary of 10BASE-T1S Chip Vendors and Product Performance Features (1)
Summary of 10BASE-T1S Chip Vendors and Product Performance Features (2)
Summary of 10BASE-T1S Chip Vendors and Product Performance Features (3)
New 10BASE-T1S Chip 1
………………
New 10BASE-T1S Chip 6
10BASE-T1S Application Solution 1
………………
10BASE-T1S Application Solution 10

3.3.2 CAN XL
Application Advantages
CAN-XL OSI Protocol Framework
CAN-XL vs 10Base-T1S (1)
CAN-XL vs 10Base-T1S (2)
CAN-XL vs 10Base-T1S (3)
CAN-XL vs 10Base-T1S (4)
CAN-XL vs 10Base-T1S (5)
CAN-XL Hybrid Network Application Architecture 1
CAN-XL Hybrid Network Application Architecture 2
CAN-XL Industrial Chain Progress
Summary of CAN-XL Transceiver Chip Vendors and Product Performance Features
CAN-XL Transceiver Product 1
CAN-XL Transceiver Product 2
Core CAN XL Product Suppliers and Product List (1)
Core CAN XL Product Suppliers and Product List (2)
Core CAN XL Product Suppliers and Product List (3)
Core CAN XL Product Suppliers and Product List (4)

3.4 High-Speed Video Transmission Technologies
3.4.1 In-Vehicle SerDes Standards and Protocols
In-Vehicle High-Speed Video Transmission Technology: SerDes Application Scenarios
SerDes Standards and Protocols: Summary of Proprietary Protocols (1)
SerDes Standards and Protocols: Summary of Proprietary Protocols (2)
Proprietary Protocol–GMSL Going Public (1)
Proprietary Protocol–GMSL Going Public (2)
SerDes Standards and Protocols: Summary of Public Protocols (1)
SerDes Standards and Protocols: Summary of Public Protocols (2)
Public Protocol – Comparison Between MIPI A-PHY and HSMT Solutions (1)
Public Protocol – Comparison Between MIPI A-PHY and HSMT Solutions (2)
Public Protocol – Comparison Between MIPI A-PHY and HSMT Solutions (3)
Public Protocol – Comparison Between MIPI A-PHY and HSMT Solutions (4)
Public Protocol – Ecosystem Integration of ASA-ML and MIPI A-PHY

3.4.2 Summary of Domestic and Overseas In-Vehicle SerDes Vendors and Products
In-Vehicle SerDes Vendors and Product Selection (1)
In-Vehicle SerDes Vendors and Product Selection (2)
In-Vehicle SerDes Vendors and Product Selection (3)
......
In-Vehicle SerDes Vendors and Product Selection (11)
SerDes Chip Product (1)
......
SerDes Chip Product (5)

3.4.3 Market Size and Competitive Landscape of In-Vehicle SerDes Chips
Market Size of In-Vehicle SerDes Chips for China Passenger Cars (excluding import & export), 2023-2030E (1)
Market Size of In-Vehicle SerDes Chips for China Passenger Cars (excluding import & export), 2023-2030E (2)
......
Market Size of In-Vehicle SerDes Chips for China Passenger Cars (excluding import & export), 2023-2030E (5)

Global Market Size of In-Vehicle SerDes Chips for Passenger Cars, 2022-2030E
Competitive Landscape of In-Vehicle SerDes Chips
Domestic Substitution of In-Vehicle SerDes Chips (1)
Domestic Substitution of In-Vehicle SerDes Chips (2)

3.5 48V Communication Chips
Performance Requirements for 48V Communication Chips
48V In-Vehicle Communication Bus Standard
Summary of 48V Communication Chip Vendors and Products
Product Analysis of 48V Communication Chip

4 Research on Overseas In-Vehicle Communication Chip Vendors
4.1 ADI
In-Vehicle Communication Product Line Layout I: Summary of In-Vehicle SerDes Chip Products and Performance Characteristics
In-Vehicle SerDes: GMSL Open Sourced and Establishment of the OpenGMSL Alliance
In-Vehicle SerDes: GMSLE (GMSL Evolving Toward Ethernet)
In-Vehicle SerDes Chip Product I:
In-Vehicle SerDes Transmission Solution I:
In-Vehicle SerDes Transmission Solution II:
In-Vehicle SerDes Transmission Solution III:
In-Vehicle Communication Product Line Layout II: Summary of A2B Audio Bus Products and Performance Characteristics
A2B Audio Bus: New-Generation A2B 2.0 Technology (1)
A2B Audio Bus: New-Generation A2B 2.0 Technology (2)
A2B Audio Bus: A2B 1.0 vs A2B 2.0
A2B Transceiver Product: A2B 2.0 Transceiver ADAA245x Series
A2B Audio Transmission Solution I
A2B Audio Transmission Solution II
In-Vehicle Communication Product Line Layout III: Summary of 10M Ethernet Products and Performance Characteristics
10M In-Vehicle Ethernet Technology: E2B Edge Node Bus Enables MCU-Less Operation (1)
10M In-Vehicle Ethernet Technology: E2B Edge Node Bus Enables MCU-Less Operation (2)
10M In-Vehicle Ethernet Chip Product I
10M In-Vehicle Ethernet Chip Product II
10M In-Vehicle Ethernet Communication Solution I
10M In-Vehicle Ethernet Communication Solution II
10M In-Vehicle Ethernet Communication Solution III

4.2 Texas Instruments
In-Vehicle Communication Product Line Layout I: Summary of In-Vehicle SerDes Chip Products and Performance Characteristics
In-Vehicle SerDes: FPD-LINK III Adopted as the Mainstream at the Current Stage
In-Vehicle SerDes: FPD-Link IV Application Roadmap
In-Vehicle Communication Product Line Layout II: Summary of In-Vehicle Ethernet PHY Chip Products and Performance Characteristics
In-Vehicle Ethernet: RCE Protocol Promoted for Edge Nodes, Benchmarking RCP (1)
In-Vehicle Ethernet: RCE Protocol Promoted for Edge Nodes, Benchmarking RCP (2)
In-Vehicle Ethernet Technology Development
In-Vehicle Ethernet Chip Product I:
In-Vehicle Ethernet Chip Product II:
In-Vehicle Ethernet Solution I:
In-Vehicle Ethernet Solution II:
In-Vehicle Ethernet Solution III:
In-Vehicle Communication Product Line Layout III: Summary of CAN Transceiver Products and Performance Characteristics

4.3 Infineon
Summary of In-Vehicle Ethernet PHY Chip Products and Performance Characteristics (1)
Summary of In-Vehicle Ethernet PHY Chip Products and Performance Characteristics (2)
Summary of In-Vehicle Ethernet Switch Chip Products and Performance Characteristics
In-Vehicle Ethernet Chip Product:
In-Vehicle Ethernet Solution I:
In-Vehicle Ethernet Solution II:
In-Vehicle Communication Product Line Layout III: CAN Product Line Layout

4.4 NXP
Summary of In-Vehicle Ethernet PHY Chip Products and Performance Characteristics
Summary of In-Vehicle Ethernet Switch Chip Products and Performance Characteristics
In-Vehicle Ethernet Chip Product
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics
NXP In-Vehicle SerDes: ASA-ML
NXP In-Vehicle SerDes Chip Product
Summary of CAN Transceiver Products and Performance Characteristics
NXP CAN-XL Transceiver Products
Summary of LIN Transceiver Products and Performance Characteristics

4.5 Broadcom
Summary of In-Vehicle Ethernet PHY Chip Products and Performance Characteristics
Summary of In-Vehicle Ethernet Switch Chip Products and Performance Characteristics
Broadcom In-Vehicle Ethernet Physical Layer BroadR-Reach Technology
Broadcom In-Vehicle Ethernet Chip Product

4.6 Microchip
Summary of In-Vehicle Ethernet PHY Chip Products and Performance Characteristics (1)
Summary of In-Vehicle Ethernet PHY Chip Products and Performance Characteristics (2)
Summary of In-Vehicle Ethernet Switch Chip Products and Performance Characteristics
In-Vehicle Ethernet Chip Product I
In-Vehicle Ethernet Chip Product II
In-Vehicle Ethernet Chip Product III
In-Vehicle Ethernet Transmission Solution I
In-Vehicle Ethernet Transmission Solution II
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics
In-Vehicle SerDes: Based on ASA-ML Universal Protocol
In-Vehicle SerDes Chip Product
Microchip In-Vehicle SerDes Transmission Solution I
Microchip In-Vehicle SerDes Transmission Solution II

4.7 ROHM
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics (for ADAS Cameras)
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics (for Display Panels)
In-Vehicle SerDes: Clockless Link-BD (1)
In-Vehicle SerDes: Clockless Link-BD (2)
In-Vehicle SerDes Transmission Solution I:
In-Vehicle SerDes Transmission Solution II
In-Vehicle SerDes Transmission Solution III

4.8 onsemi
Summary of 10M In-Vehicle Ethernet Products and Performance Characteristics
10M In-Vehicle Ethernet Technology 1
.......
10M In-Vehicle Ethernet Technology 4
10M In-Vehicle Ethernet Technology: Harness Defect Detection (HDD)
In-Vehicle Ethernet Chip Product I: 2nd-Generation 10BASE-T1S MAC-PHY Device T30HM1TS2500
In-Vehicle Ethernet Chip Product II
10M Ethernet Application Solution I: RCP and ONCP Full-Stack Solution to Build a Flat Architecture of “Domain Controller – RCP Chip – Terminal Driver”
10M Ethernet Application Solution II
10M Ethernet Application Solution III
10M Ethernet Application Solution IV
10M Ethernet Application Solution V

4.9 Inova
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics (1)
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics (2)
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics (3)
In-Vehicle SerDes: Based on APIX Proprietary Protocol
In-Vehicle SerDes Application Solution

4.10 KD Semiconductor
Roadmap for In-Vehicle Fiber Ethernet Transceivers
In-Vehicle Communication Product Line Layout I: Summary of In-Vehicle Fiber Ethernet Transceiver Products and Performance Characteristics
In-Vehicle Optical Communication: Industrial Chain Layout
In-Vehicle Fiber Ethernet Chip Product (1): Multi-Gigabit Optical Ethernet Transceiver KD7251
In-Vehicle Fiber Ethernet Chip Product (2)
In-Vehicle Fiber Ethernet Chip Product (3)
In-Vehicle Optical Module Product
In-Vehicle Fiber Ethernet Application Solution I
In-Vehicle Fiber Ethernet Application Solution II

5 Research on Domestic In-Vehicle Communication Chip Vendors
5.1 Motorcomm
Roadmap for In-Vehicle Communication Chips
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics
In-Vehicle SerDes: Based on the HSMT Public Standard
In-Vehicle SerDes Chip Product
Summary of In-Vehicle Ethernet PHY Chip Products and Performance Characteristics
Summary of In-Vehicle Ethernet Switch Chip Products and Performance Characteristics
Next-Generation Technology Layout I for In-Vehicle Ethernet PHY Chips: MACsec
Next-Generation Technology Layout II for In-Vehicle Ethernet PHY Chips
In-Vehicle Ethernet Chip Product:
In-Vehicle Communication Application Solution

5.2 Tasson
Summary of In-Vehicle Ethernet Switch Chip Products and Performance Characteristics
Summary of In-Vehicle Optical PON Communication Chip Products and Performance Characteristics
In-Vehicle Optical Communication Chip Product

5.3 Norelsys
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics (for Cameras)
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics (for Displays)
In-Vehicle SerDes: The First to Obtain Triple Functional Safety Certifications
In-Vehicle SerDes Application Solution I
In-Vehicle SerDes Application Solution II
In-Vehicle SerDes Application Solution III

5.4 Rsemi Technology
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics
In-Vehicle SerDes Chip Product I
In-Vehicle SerDes Chip Product II
In-Vehicle SerDes Application Solution I
In-Vehicle SerDes Application Solution II
In-Vehicle SerDes Application Solution III
In-Vehicle SerDes Application Solution IV

5.5 HINGE Technology
Summary of In-Vehicle Optical Communication Products and Performance Characteristics
In-Vehicle Optical Communication
In-Vehicle Optical Communication Application Solution I
In-Vehicle Optical Communication Application Solution II
In-Vehicle Optical Communication Application Solution III
In-Vehicle Optical Communication Application Solution IV

5.6 Realtek
Summary of In-Vehicle Ethernet PHY Chip Products and Performance Characteristics
Summary of In-Vehicle Ethernet Switch Chip Products and Performance Characteristics
In-Vehicle Ethernet Chip Product
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics

5.7 Velinktech
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics (for Cameras)
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics (for Displays)
In-Vehicle SerDes Chip Product I
In-Vehicle SerDes Chip Product II
In-Vehicle SerDes Chip Product III
In-Vehicle SerDes Application Solution I
In-Vehicle SerDes Application Solution II
In-Vehicle SerDes Application Solution III
In-Vehicle SerDes Application Solution IV
In-Vehicle SerDes Application Solution V

5.8 Novosense
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics
In-Vehicle SerDes Chip Product
In-Vehicle SerDes Application Solution
In-Vehicle In-Vehicle CAN Application Solution
In-Vehicle LIN Application Solution

5.9 Neuron Information Technology (Chengdu) Co., Ltd.
Summary of In-Vehicle Ethernet PHY Chip Products and Performance Characteristics
Summary of In-Vehicle Ethernet Switch Chip Products and Performance Characteristics
In-Vehicle Ethernet Chip Product
Summary of AUTBUS Bus Chip Products and Performance Characteristics
In-Vehicle AUTBUS: Bus Communication Technology
In-Vehicle AUTBUS Bus Chip Product

5.10 JLSemi
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics
In-Vehicle SerDes Application Solution
Summary of In-Vehicle Ethernet Chip Products and Performance Characteristics
Core Technology of In-Vehicle Ethernet
In-Vehicle Ethernet Application Solution

5.11 Poncan Semiconductor
Summary of In-Vehicle Optical Communication Chip Products and Performance Characteristics
In-Vehicle Optical Communication Technology
In-Vehicle Optical Communication Chip Product
In-Vehicle Optical Communication Architecture Solution
In-Vehicle Optical Communication Application Solution

5.12 KunGao Xinxin
Summary of In-Vehicle Ethernet Chip Products and Performance Characteristics
In-Vehicle Ethernet Chip Product
In-Vehicle Ethernet Application Solution

5.13 AIM Technology
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics (for Cameras)
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics (for Displays)
In-Vehicle SerDes: Based on Proprietary Protocol AHDL
In-Vehicle SerDes Chip Product

5.14  SITCORES
Summary of CAN Transceiver Products and Performance Characteristics
Summary of LIN Transceiver Products and Performance Characteristics
In-Vehicle CAN Transceiver Product

5.15 Lontium Semiconductor
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics (for Cameras)
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics (for Displays)
In-Vehicle SerDes Application Solution I: ADAS Solution with Dual 8MP Front Cameras
In-Vehicle SerDes Application Solution II
In-Vehicle SerDes Application Solution III
In-Vehicle SerDes Application Solution IV
In-Vehicle SerDes Application Solution V

5.15 OmniVision Group
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics (for Cameras)
In-Vehicle SerDes Chip Product

5.17 SIMCHIP
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics
In-Vehicle SerDes Chip Product
In-Vehicle SerDes Application Solution I
In-Vehicle SerDes Application Solution II

5.18 Meritech
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics (for Cameras)
Summary of In-Vehicle SerDes Chip Products and Performance Characteristics (for Displays)
In-Vehicle SerDes Application Solution: ADAS Sensor Data Transmission Solution for Cockpit -Driving Integrated Computer

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